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PAL16L8AMWB

Texas Instruments

PAL16L8AMWB by Texas Instruments

PAL16L8AMWB by Texas Instruments is a TTL technology-based PLD with 30 ns propagation delay, 64 product terms, and 25 MHz max clock frequency. It features 10 dedicated inputs and 6 I/O lines, suitable for military-grade applications requiring combinatorial output functions in a flatpack package style.

Median Price

$50.054

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Freelance Electronics

USA . 19 parts In-Stock

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$50.054

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$52.556

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Vyrian

USA . 8,202 parts In-Stock

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Digiode

USA . 119 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 31 parts In-Stock

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Resion

USA . 29 parts In-Stock

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Electronic Expediters

USA . 3 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 291 parts In-Stock

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$5.868

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One Stop Electronics

USA . 980 parts In-Stock

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$19.000

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980

$19.000

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Parana Technologies

USA . 1,024 parts In-Stock

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$78.862

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DigiPath Technology Company

USA . 2,240 parts In-Stock

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$86.837

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$79.890

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$86.837

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ChromeModa Solutions

Germany . 3,728 parts In-Stock

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$88.609

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$72.659

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IDEA Electronic Components Group

UK . 2,257 parts In-Stock

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$88.609

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$84.179

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$79.748

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2,257

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$84.179

$79.748

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Corphita

USA . 3,213 parts In-Stock

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Microchip USA

USA . 2,672 parts In-Stock

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Overview

Enhance your electronic designs with the PAL16L8AMWB from Texas Instruments, a leading manufacturer known for superior quality and reliability. As part of the Programmable Logic Devices category, this product offers unmatched versatility and flexibility for a range of applications. With its advanced technology and high performance, customers can expect seamless operation and efficient functionality. Discover the value and benefits of the PAL16L8AMWB and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and reliability, making this product suitable for harsh environments.

Propagation Delay: 30 ns

With a low propagation delay of 30 ns, this PLD offers fast processing speeds, which is essential for time-sensitive applications.

Surface Mount: YES

Being surface mountable simplifies the assembly process and allows for more compact designs, saving space on the PCB.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V provides flexibility in power supply options while ensuring safe operation within the specified voltage range.

Screening Level: 38535Q/M;38534H;883B

Meeting stringent screening levels such as 38535Q/M, 38534H, and 883B ensures high reliability and performance consistency in critical applications.

Technology Used: TTL

Utilizing TTL technology offers compatibility with other TTL components and ensures reliable logic operations in the system.

No. of Inputs: 16

Having 16 inputs provides flexibility in designing complex logic functions and accommodating various input signals.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing circuit layouts and facilitates efficient PCB design.

Form Of Terminal: FLAT

The flat form of terminals simplifies soldering and facilitates a secure connection with the PCB, ensuring reliability in signal transmission.

Architecture: PAL-TYPE

The PAL-type architecture offers programmable logic functions that can be tailored to specific application requirements, enhancing versatility and customization.

Nominal Supply Voltage (V): 5

With a nominal supply voltage of 5 V, this PLD is compatible with standard power supply configurations and simplifies system integration.

Packing Method: TUBE

The tube packing method ensures convenient storage, handling, and transportation of the PLDs, reducing the risk of damage during shipping.

Power Supplies (V): 5

Having power supplies of 5 V ensures consistent and stable voltage levels for reliable operation of the PLD.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for input, output, and power, enabling versatile interfacing with other components in the system.

Programmable IC Type: OT PLD

Being an OT (Output Terminal) PLD allows for flexible configuration of output functions, making it suitable for diverse application requirements.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact form factor, saving space on the PCB and enabling high-density integration of multiple PLDs.

Output Function: COMBINATORIAL

Supporting combinatorial output functions enables flexible logic operations and decision-making processes within the system.

No. of Product Terms: 64

Having 64 product terms allows for the implementation of complex logic functions and supports versatile programming options for diverse applications.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5 V, this PLD can operate efficiently across a range of voltage levels, offering flexibility in power supply options.

Maximum Operating Temperature: 125 °C

The maximum operating temperature of 125°C ensures reliability and performance stability in high-temperature environments or under heavy load conditions.

Pitch Of Terminal: 1.27 mm

The terminal pitch of 1.27 mm allows for precise and secure connections on the PCB, reducing the risk of signal interference or loss.

Organization: 10 DEDICATED INPUTS, 6 I/O

The organization of 10 dedicated inputs and 6 I/O lines offers a balanced input-output configuration, facilitating efficient signal processing and control.

No. of Dedicated Inputs: 10

Having 10 dedicated inputs streamlines the interface design and simplifies the routing of input signals, enhancing system efficiency.

Minimum Operating Temperature: -55 °C

The minimum operating temperature of -55°C ensures reliable performance in cold environments or under extreme temperature conditions.

Finishing Of Terminal Used: Tin/Lead (Sn/Pb)

The tin/lead finishing of terminals provides excellent solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Position Of Terminal: DUAL

The dual position of terminals offers flexibility in circuit layout and facilitates easy connection to the PCB, enhancing ease of installation and maintenance.

Maximum Seated Height: 2.54 mm

The maximum seated height of 2.54 mm allows for low-profile mounting on the PCB, minimizing space requirements and enabling compact system designs.

Width: 6.92 mm

With a width of 6.92 mm, this PLD offers a compact form factor, making it suitable for applications where space is at a premium.

Maximum Clock Frequency: 25 MHz

Supporting a maximum clock frequency of 25 MHz enables rapid data processing and high-speed operation, essential for demanding real-time applications.

No. of Outputs: 8

Having 8 outputs provides flexibility in routing and controlling multiple output signals, allowing for efficient data processing and system operation.

Length: 13.09 mm

With a length of 13.09 mm, this PLD offers a balanced form factor that can accommodate a sufficient number of terminals while maintaining a compact design.

No. of I/O Lines: 6

The 6 I/O lines offer versatile connectivity options for interfacing with external devices, enabling seamless integration into various systems and applications.

Grading Of Temperature: MILITARY

The military-grade temperature grading ensures reliable performance in harsh environmental conditions, making this PLD suitable for defense and aerospace applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL16L8AMWB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

25 MHz

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

Flatpack

Package Code:

DFP

Package Shape:

Package Equivalence Code:

FL20,.3

Width:

6.92 mm

Length:

13.09 mm

Maximum Seated Height:

2.54 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Tin/Lead

Standards

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

PAL16L8AMWB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-234-0874, 5962012340874, 5962-01-265-5983, 5962012655983

NIIN

012340874, 012655983

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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