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PAL16L8AMFH

Texas Instruments

PAL16L8AMFH by Texas Instruments

PAL16L8AMFH by Texas Instruments is a TTL technology-based PLD with 30 ns propagation delay. It features 16 inputs, 8 outputs, and 64 product terms in a ceramic chip carrier package. Ideal for military applications due to its wide operating temperature range of -55°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,854 parts In-Stock

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Digiode

USA . 3,018 parts In-Stock

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3,018

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Distributors (Availability)

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AZTECH Wire

Italy . 206 parts In-Stock

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$14.738

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206

$14.738

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One Stop Electronics

USA . 177 parts In-Stock

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$33.000

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Parana Technologies

USA . 1,020 parts In-Stock

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$68.564

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$68.564

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DigiPath Technology Company

USA . 605 parts In-Stock

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$75.497

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$69.457

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605

$75.497

$69.457

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ChromeModa Solutions

Germany . 4,784 parts In-Stock

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$77.038

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$63.171

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4,784

$77.038

$63.171

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IDEA Electronic Components Group

UK . 1,823 parts In-Stock

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$77.038

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$73.186

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$69.334

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1,823

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$69.334

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Corphita

USA . 1,350 parts In-Stock

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Overview

Unleash the power of technology with the PAL16L8AMFH by Texas Instruments, a high-quality Programmable Logic Device that offers unparalleled performance and reliability. As a trusted manufacturer in the industry, Texas Instruments ensures top-notch craftsmanship and innovation in every product. Perfect for a wide range of applications, this PLD provides fast propagation delay and versatile output functions, making it an essential component for your projects. Elevate your designs with the PAL16L8AMFH and experience the value and benefits it brings to your creations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and mechanical protection, making the device highly reliable and durable.

Propagation Delay: 30 ns

Fast propagation delay ensures quick response time and efficient operation of the device.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Technology Used: TTL

TTL technology offers compatibility with a wide range of digital systems and ensures reliable signal processing.

No. of Inputs: 16

With 16 input channels, this device can handle a variety of input signals and perform complex logic functions.

Package Shape: SQUARE

Square package shape makes it easy to mount and align the device on a PCB, ensuring accurate placement.

Form Of Terminal: NO LEAD

Lead-free terminals are environmentally friendly and comply with RoHS regulations, making the product sustainable.

Architecture: PAL-TYPE

PAL-type architecture offers versatile programmability and customization options, allowing for specific logic designs.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard digital systems and power requirements.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable performance and reliable operation of the device.

No. of Terminals: 20

With 20 terminals, this device offers flexibility in connecting to external components and peripherals for enhanced functionality.

Programmable IC Type: OT PLD

OT PLD programmable IC type allows for easy customization and reprogramming of logic functions as needed.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides compact and efficient packaging for the device, saving space and improving heat dissipation.

Output Function: COMBINATORIAL

Combinatorial output function enables the device to perform complex logic operations and generate multiple output signals simultaneously.

No. of Product Terms: 64

Having 64 product terms allows for intricate logic operations and extensive customization options to meet specific design requirements.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance in demanding environments and under varying temperature conditions.

Pitch Of Terminal: 1.27 mm

Terminal pitch of 1.27mm allows for easy connection to standard PCB layouts and facilitates efficient signal routing.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C ensures reliable operation even in extreme cold environments.

Position Of Terminal: QUAD

Quad terminal position provides convenient access and connection points for interfacing with external components and peripherals.

No. of Outputs: 8

With 8 output channels, this device can drive multiple external components or devices simultaneously, increasing functionality and versatility.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures superior performance and reliability in harsh environmental conditions and mission-critical applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL16L8AMFH attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC20,.35SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-XQCC-N20

Qualified:

No

Trade Compliance

PAL16L8AMFH Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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