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PAL16L8ACJ

Texas Instruments

PAL16L8ACJ by Texas Instruments

PAL16L8ACJ by Texas Instruments is a TTL technology-based PLD with 16 inputs, 8 outputs, and 64 product terms. It has a propagation delay of 25 ns and operates at temperatures ranging from 0 to 70°C. This programmable IC in ceramic package is ideal for combinatorial output functions in commercial applications.

Median Price

$3.398

Lifecycle Status

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Freelance Electronics

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Vyrian

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Bristol Electronics

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Sinequanon

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Beltway Electronics Company

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NAC Semi

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Electronic Expediters

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Resion

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ECAB

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Manoshevitz Elec. Sales

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PAR Electronics

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ACDS - Activité Composants Distribution Service

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Sunrise Surplus Inc.

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Inland Empire Components Inc.

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Pegasus Components GmbH

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Zilex Electronics Inc.

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Odi Ramu Company

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AZTECH Wire

Italy . 863 parts In-Stock

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One Stop Electronics

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Semicontronic

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 2,232 parts In-Stock

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IDEA Electronic Components Group

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Corphita

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Montclair Electronics, Inc.

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Glotronic Ltd.

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Cyclops Electronics Ltd (Excess)

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Overview

Upgrade your electronic designs with the PAL16L8ACJ programmable logic device from Texas Instruments. Manufactured with top-quality materials and utilizing advanced TTL technology, this PAL-TYPE architecture device offers 16 inputs and 8 outputs for versatile applications. With a fast propagation delay of 25ns, this PLD provides reliable performance in various projects. Whether you're working on industrial automation, telecommunications, or consumer electronics, the PAL16L8ACJ delivers exceptional value, efficiency, and flexibility to meet your design needs. Elevate your projects with this high-quality programmable logic device today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and high temperature resistance, ensuring reliable performance even under harsh conditions.

Propagation Delay: 25 ns

Fast propagation delay enables quick processing of signals, making this PLD suitable for applications requiring high-speed operations.

Technology Used: TTL

TTL technology offers low power consumption and compatibility with a wide range of devices, enhancing the versatility of this PLD.

No. of Inputs: 16

With 16 inputs, this PLD can accommodate a large number of input signals, making it suitable for complex logic functions.

Output Function: COMBINATORIAL

Combinatorial output function allows for efficient and flexible logic operations, making this PLD ideal for various digital design applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions, increasing the product's durability.

Technical Specifications

Programmable Logic Devices (PLD) PAL16L8ACJ attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

Propagation Delay:

25 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-XDIP-T20

Qualified:

No

Trade Compliance

PAL16L8ACJ Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-392-2823, 5962013922823, 5962-01-357-3150, 5962013573150

NIIN

013922823, 013573150

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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