Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The EPM2210F324I5N by Altera is a programmable logic device with 1700 macro cells and a maximum supply voltage of 2.625V. It is used in applications such as flash PLD, featuring a square package shape with a grid array style. The device has a propagation delay of 11.2ns and can operate at 3.3V.
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Microchip USA
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$210.600
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Futuretech Components
MARBEL Systems
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Cyclops Electronics Ltd (Excess)
The use of plastic/epoxy material for the package body makes the device lightweight and cost-effective.
The low propagation delay of 11.2 ns ensures fast and efficient operation of the device.
The surface mount capability makes it easy to integrate this PLD into circuit boards, saving space and enabling automated assembly.
The low maximum supply voltage of 2.625 V helps in reducing power consumption and heat dissipation in the system.
The high number of macro cells allows for complex programmable logic functions to be implemented effectively.
The CMOS technology used in this PLD ensures low power consumption and high noise immunity, making it suitable for a range of applications.
The square package shape helps in efficient use of board space and allows for easier placement on the PCB.
The nominal supply voltage of 2.5 V provides a stable operating voltage for the device.
Support for multiple power supply voltages makes this PLD versatile and compatible with different system requirements.
The high number of terminals allows for a large number of I/O connections, enabling versatile connectivity options.
The use of FLASH PLD technology allows for reprogramming of the device multiple times, enhancing flexibility and reusability.
The grid array package style provides better electrical performance and thermal characteristics compared to other package styles.
The in-system programmability feature allows for quick and convenient updates and modifications to the device firmware without the need for physical reprogramming.
The macrocell output function enables the device to perform complex logic operations efficiently, making it suitable for a wide range of applications.
The low minimum supply voltage of 2.375 V ensures reliable operation even under low voltage conditions.
The small pitch of 1 mm between terminals allows for high-density packaging and efficient use of board space.
The organization of 0 dedicated inputs and 272 I/O lines provides flexibility in configuring the PLD for various input/output requirements.
The use of tin, silver, and copper finishing on the terminals ensures good electrical conductivity and reliability of connections.
The bottom position of terminals makes it easier to connect the PLD to the PCB and improves signal integrity.
The moisture sensitivity level of 3 indicates that the device can withstand moderate exposure to moisture during storage and handling.
The low maximum seated height of 2.2 mm allows for slim and compact designs in electronic systems.
The width of 19 mm provides a compact form factor for the device, enabling space-efficient integration in systems.
The maximum time allowed at peak reflow temperature of 260 °C is 30 seconds, ensuring proper soldering and reliability of connections during assembly.
The peak reflow temperature of 260 °C is within standard reflow soldering temperature ranges, ensuring proper soldering and assembly of the device.
The length of 19 mm provides a compact form factor for the device, enabling space-efficient integration in systems.
The JTAG boundary scan test feature allows for efficient debugging and testing of the device during development and production stages.
The high number of I/O lines provides versatile connectivity options and enables the device to interface with a wide range of external components.
Programmable Logic Devices (PLD) EPM2210F324I5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Altera
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EPM2210F324I5N Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - MAX II EOL-Reversal 19/Mar/2021 Mult Dev EOL 4/Dec/2020
PCN Design/Specification - Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
LM555CM
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
2N2222A
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BSS138NH6327XTSA2
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
BAV99
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
TM4C1294NCPDTI3
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
LL4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
EPF10K50VRC240-3N
Altera
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;
EPM7128SQC100-15N
Intel
EPM7128SQC100-15N by Intel is a 128 macrocell EE PLD with 84 I/O lines, operating at up to 100 MHz. It features a propagation delay of 15 ns and can be used for applications requiring in-system programmability and JTAG boundary scan testing.
XC95144XL-10TQ144I
Xilinx
XC95144XL-10TQ144I by Xilinx is a 3.3V CMOS PLD with 117 I/O lines, 144 macro cells, and 81.3 MHz clock frequency. Ideal for industrial applications, it offers in-system programmability and JTAG boundary scan testing capabilities in a low-profile package with Gull Wing terminals.
XC2C32A-6VQG44I
XC2C32A-6VQG44I by Xilinx is a programmable logic device (PLD) with 32 macro cells. It uses CMOS technology and has a max clock frequency of 300 MHz. This PLD is commonly used in industrial applications for its high performance and in-system programmability.
XC2C256-7CPG132C
XC2C256-7CPG132C by Xilinx is a 256 macrocell FLASH PLD with 106 I/O lines, operating at up to 300 MHz. It features a propagation delay of 7.5 ns and can be in-system programmable. Ideal for applications requiring high-speed processing and versatile I/O capabilities in commercial-grade environments.
ATF16V8BQL-15PU
Atmel
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
5M160ZE64C4
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 64; Package Code: HTFQFP; Package Shape: SQUARE;
XCR3032XL-7VQG44C
The Xilinx XCR3032XL-7VQG44C is a programmable logic device (PLD) with 32 macro cells. It operates on a supply voltage of 3.3V and has a max clock frequency of 119 MHz. This PLD is commonly used for in-system programmable applications requiring high-speed processing.
EPM570ZM256C6N
The Intel EPM570ZM256C6N is a FLASH PLD with 440 macro cells, 160 I/O lines, and 9.5 ns propagation delay. It is ideal for applications requiring programmable logic devices with low latency and high input/output capacity. The device features in-system programmability, JTAG boundary scan test support, and operates b/w 0-85°C temperature range.
EPM7128SQI100-10
EPM7128SQI100-10 by Intel is a 128 macrocell EE PLD with 84 I/O lines, operating at up to 125 MHz. It features a propagation delay of 10 ns and can handle a max supply voltage of 5.5 V. Ideal for industrial applications requiring high-speed programmable logic devices in compact form factors.
LC4032V-25TN48C
Lattice Semiconductor
LC4032V-25TN48C by Lattice Semiconductor is a 32 macrocell EE PLD with 36 inputs and 32 I/O. With a propagation delay of 2.5 ns and max clock frequency of 250 MHz, it's ideal for applications requiring fast processing speeds. Its thin profile flatpack package makes it suitable for space-constrained designs in various electronic systems.
EPM1270F256C5N
EPM1270F256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It uses CMOS technology and has a max supply voltage of 2.625V. This PLD is suitable for applications requiring in-system programmability and a fast propagation delay of 10ns.
ATF1502AS-7AX44-T
Microchip Technology
Microchip Technology's ATF1502AS-7AX44-T is a PLD with 32 I/O lines, 7.5 ns propagation delay, and 166.7 MHz max clock frequency. Ideal for applications requiring EE PLDs in commercial environments due to its thin profile, square package shape, and GULL WING terminals.
EPM3032ATC44-7N
EPM3032ATC44-7N by Intel is a 32 macrocell EE PLD with 7.5 ns propagation delay and 138.9 MHz max clock frequency. Ideal for applications requiring in-system programmability, it operates at a max temp of 70°C with 34 I/O lines and JTAG boundary scan test capability.
ATF22V10CZ-15PI
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
EPM3128ATC100-7N
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
LC4032V-75TN48I
LC4032V-75TN48I by Lattice Semiconductor is a 32 macrocell EE PLD with 36 inputs and 32 I/O lines. It has a propagation delay of 7.5 ns, operates at a max clock frequency of 111 MHz, and can be in-system programmable. Ideal for applications requiring fast processing speeds and versatile input/output configurations.
XC9572XL-7VQG44C
Xilinx XC9572XL-7VQG44C is a 3.3V CMOS PLD with 72 macro cells, 34 I/O lines, and 125MHz clock frequency. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications equipment. Package: PLASTIC/EPOXY, Surface Mount: YES, Propagation Delay: 7.5ns.
ATF16V8BQL-15JU
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
ATF1504ASV-15AU44
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
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EPM240T100C5N
Intel's EPM240T100C5N is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its CMOS technology and flash memory.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EPM240T100I5N
EPM240T100I5N by Intel is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. It is used for applications requiring in-system programmability, such as digital signal processing and control systems due to its CMOS technology and JTAG boundary scan test capability.
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Output Function: MACROCELL;
EPM240T100C5NAH
EPM240T100C5NAH by Intel is a FLASH PLD with 192 macro cells and 80 I/O lines. It has a propagation delay of 7.5 ns, operates at a max clock frequency of 104.16 MHz, and supports JTAG boundary scan test. Ideal for applications requiring fast processing speeds and high input/output capabilities in programmable logic devices (PLD).
EPM2210F256I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 2.625 V;
The Intel EPM2210F256I5N is a programmable logic device (PLD) with 1700 macro cells and 204 inputs/outputs. It uses CMOS technology, has a max supply voltage of 2.625V, and is surface mountable. This PLD is commonly used for in-system programming and outputting macrocell functions.
EPM240M100C5N
The Intel EPM240M100C5N is a FLASH PLD with 192 macro cells, 80 inputs/outputs, and 7.5 ns propagation delay. It uses CMOS technology, operates at a max temp of 85°C, and has JTAG boundary scan test capability. Ideal for applications requiring programmable logic devices with fast signal processing and high I/O count in compact form factors.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE;
EPM240T100C4N
Intel's EPM240T100C4N is a PLD with 192 macro cells, 80 inputs/outputs, and 6.1ns propagation delay. Ideal for applications requiring fast processing speeds and high I/O capacity in compact designs. Its CMOS technology and in-system programmability make it versatile for various electronic projects.
EPM2210F256C5N
The Intel EPM2210F256C5N is a FLASH PLD with 1700 macro cells, 204 inputs/outputs, and 11.2 ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its CMOS technology and JTAG boundary scan test capability.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EPM240ZM100C7N
The Intel EPM240ZM100C7N is a 192 macrocell FLASH PLD with 80 inputs/outputs, 12 ns propagation delay, and CMOS technology. Ideal for applications requiring in-system programmability, it features a grid array package style and JTAG boundary scan test capability.
EPM240T100A5N
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EPM240T100A5N by Intel is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. It uses CMOS technology, has a max supply voltage of 2.625V, and is in-system programmable. Ideal for automotive applications due to its high operating temperature range of -40 to 125°C and JTAG boundary scan test capability.
EPM240F100C5N
Intel's EPM240F100C5N is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its low profile grid array package style.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;
EPM240T100C3N
Intel's EPM240T100C3N is a PLD with 192 macro cells, 80 inputs/outputs, and 4.7ns propagation delay. Ideal for applications requiring fast processing speeds and high input/output capabilities in compact designs.
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