Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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EPX740LC44-10Z
Altera
OT PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
OT PLD
0 Dedicated Inputs, 30 I/O
32
Macrocell
0
40
30
71.4 MHz
12 ns
CMOS
Field Programmable Gate Arrays
4 Labs; 40 Macrocells Configurable I/O operation with 3.3 V or 5 V
5
4.75 V
5.25 V
5 V
70 °C (158 °F)
0 °C (32 °F)
Commercial
220 °C (428 °F)
Plastic/Epoxy
Chip Carrier
QCCJ
Square
LDCC44,.7SQ
16.5862 mm
4.57 mm
Quad
J Bend
44
1.27 mm
Tin Lead
S-PQCC-J44
e0
No
EPX740LI44-12
OT PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
58.8 MHz
15 ns
4.5 V
5.5 V
85 °C (185 °F)
-40 °C (-40 °F)
Industrial
EPX780QC132-15Z
OT PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE;
22 Dedicated Inputs, 80 I/O
104
22
80
50 MHz
18 ns
8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V
3
Flatpack, Bumper
BQFP
SPQFP132,1.1SQ
24.13 mm
Gull Wing
132
.635 mm
S-PQFP-G132
EPS448LC-20
OT PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
8 Dedicated Inputs, 0 I/O
Registered
8
20 MHz
Stand-Alone Microsequencer
11.5062 mm
4.572 mm
28
S-PQCC-J28
EPS448JC-25
UV PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 28; Package Code: WQCCJ; Package Shape: SQUARE;
UV PLD
25 MHz
Ceramic, Metal-Sealed Cofired
Chip Carrier, Window
WQCCJ
11.43 mm
4.826 mm
S-CQCC-J28
EPF81188ARC240-2
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
Loadable PLD
4 Dedicated Inputs, 184 I/O
180
184
4
1008
417 MHz
1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V
3.3/5,5 V
Flatpack, Fine Pitch
FQFP
HQFP240,1.37SQ,20
32 mm
4.1 mm
240
.5 mm
S-PQFP-G240
EPF81188ARC240-3
385 MHz
EPF81188ARC240-4
357 MHz
EPF81500ARC240-2
4 Dedicated Inputs, 181 I/O
177
181
1296
1.7 ns
1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V
EPF81500ARC240-3
EPF81500ARI240-3
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
1.8 ns
EPF8282AVTC100-3
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
4 Dedicated Inputs, 78 I/O
74
78
208
208 Logic Elements
3.3
3 V
3.6 V
3.3 V
Flatpack, Low Profile, Fine Pitch
LFQFP
TQFP100,.63SQ
14 mm
100
S-PQFP-G100
EPF8820ARC208-2
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
4 Dedicated Inputs, 152 I/O
148
152
672
672 Logic elements; Configurable I/O operation with 3.3 V or 5 V
HQFP208,1.2SQ,20
28 mm
S-PQFP-G208
EPF8820ARC208-3
EPF8820ARC208-4
EPF8452AGC160-3
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: PIN/PEG; No. of Terminals: 160; Package Code: PGA; Package Shape: SQUARE;
4 Dedicated Inputs, 120 I/O
116
120
336
336 Logic Elements
1
Grid Array
PGA
PGA160M,15X15
39.624 mm
5.34 mm
Perpendicular
Pin/Peg
160
2.54 mm
S-CPGA-P160
EPF8282AVTC100-4
EPM7032VLC44-15
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
EE PLD
0 Dedicated Inputs, 32 I/O
76.9 MHz
Programmable Logic Devices
Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock
EPM7032VTC44-12
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;
90.9 MHz
Flatpack, Low Profile
LQFP
TQFP44,.47SQ,32
10 mm
.8 mm
S-PQFP-G44
EP224PC-10
OT PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
13 Dedicated Inputs, 8 I/O
72
13
62.5 MHz
10 ns
PAL-TYPE
8 Macrocells
In-Line
DIP
Rectangular
DIP24,.3
7.62 mm
31.6865 mm
4.318 mm
Dual
Through-Hole
24
R-PDIP-T24
EP224PC-7
100 MHz
7.5 ns
EP224LC-10
LDCC28,.5SQ
EP224LC-12
EP224LC-7
EP324DC-25
Programmable Logic Devices; Grading Of Temperature: COMMERCIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;
36
394
33 MHz
25 ns
Ceramic
DIP40,.6
R-XDIP-T40
EPF10K100BFC256-1
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
191 I/O
191
Mixed
4992
140 MHz
11 ns
4992 Logic Elements
2.5
2.3 V
2.7 V
2.5,2.5/3.3 V
BGA
BGA256,16X16,40
17 mm
2.1 mm
Bottom
Ball
256
1 mm
S-PBGA-B256
EPF10K100BFC256-2
EPF10K10AFC256-3
4 Dedicated Inputs, 150 I/O
150
576
80 MHz
0.8 ns
576 Logic Elements; 72 Labs
2.5/3.3,3.3 V
BGA256,20X20,50
EPF10K50SFI484-2
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
254 I/O
254
2880
0.4 ns
2.375 V
2.625 V
BGA484,22X22,40
23 mm
484
S-PBGA-B484
EP610ILI-25
Programmable Logic Devices; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
16
20
40 MHz
Plastic
EPF81500ARC304-2
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 304; Package Code: FQFP; Package Shape: SQUARE;
4 Dedicated Inputs, 208 I/O
204
Can also operate at 5 V supply
HQFP304,1.7SQ,20
40 mm
4.5 mm
304
S-PQFP-G304
EPF81500ARC304-4
1.9 ns
30 s
Tin/Lead
EPF6024ABI256-2
EPF6024ABI256-2 by Altera is a 1960 logic cell PLD with 218 inputs/outputs, operating at max 153 MHz clock frequency. It uses CMOS technology, has a supply voltage of 3.3V, and comes in a square grid array package. Ideal for applications requiring high-speed processing and extensive I/O capabilities.
4 Dedicated Inputs, 218 I/O
218
1960
153 MHz
Also Configurable with 5 V VCC
BGA256(UNSPEC)
27 mm
2.3 mm
EPF6016AQI208-2
LOADABLE PLD; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 220;
4 Dedicated Inputs, 171 I/O
171
1320
QFP208,1.2SQ,20
EPF6024AQI208-3
LOADABLE PLD; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Finishing Of Terminal Used: TIN LEAD;
Typical gates = 12000 to 240000
EPF10K30ABI356-3
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 356; Package Code: LBGA; Package Shape: SQUARE;
4 Dedicated Inputs, 246 I/O
246
1728
0.9 ns
1728 Logic Elements; 216 Labs
Grid Array, Low Profile
LBGA
BGA356,26X26,50
35 mm
1.63 mm
356
S-PBGA-B356
EPF10K130VBC600-2
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 600; Package Code: BGA; Package Shape: SQUARE;
4 Dedicated Inputs, 470 I/O
470
6656
0.5 ns
BGA600,35X35,50
45 mm
1.93 mm
600
S-PBGA-B600
EPF10K130VBC600-3
0.7 ns
EPF10K130VBC600-4
EPF10K250ABC600-2
12160
0.6 ns
12160 Logic Elements; 1520 Labs
EPF10K100GC503-3DX
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: PIN/PEG; No. of Terminals: 503; Package Code: IPGA; Package Shape: SQUARE;
4 Dedicated Inputs, 406 I/O
406
Grid Array, Interstitial Pitch
IPGA
SPGA503,43X43
57.4 mm
5.077 mm
503
S-CPGA-P503
EPF10K200EGC599-1
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: PIN/PEG; No. of Terminals: 599; Package Code: PGA; Package Shape: SQUARE;
470 I/O
9984
9984 Logic Elements
SPGA599,47X47
62.484 mm
5.08 mm
599
S-CPGA-P599
EPF10K200EGC599-2
EPF10K200EGC599-3
EPF10K250AGC599-1
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: PIN/PEG; No. of Terminals: 599; Package Code: IPGA; Package Shape: SQUARE;
EPF10K250AGC599-2
EPF10K250AGC599-3
EPF10K100BQC208-2
147 I/O
147
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