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PAL16L8AMW

Texas Instruments

PAL16L8AMW by Texas Instruments

PAL16L8AMW by Texas Instruments is a TTL technology-based PLD with 30 ns propagation delay. It features 16 inputs, 8 outputs, and 6 I/O lines in a ceramic package. Ideal for military applications due to its wide operating temperature range of -55°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,274 parts In-Stock

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Digiode

USA . 2,423 parts In-Stock

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2,423

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Electronic Expediters

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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AZTECH Wire

Italy . 355 parts In-Stock

1+ parts

$7.455

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355

$7.455

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Parana Technologies

USA . 70 parts In-Stock

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$23.904

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$24.538

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70

$23.904

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$24.538

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DigiPath Technology Company

USA . 2,229 parts In-Stock

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$26.321

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$24.215

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2,229

$26.321

$24.215

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ChromeModa Solutions

Germany . 1,313 parts In-Stock

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$26.858

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$22.024

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1,313

$26.858

$22.024

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IDEA Electronic Components Group

UK . 1,278 parts In-Stock

1+ parts

$26.858

100+ parts

$25.515

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$24.172

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1,278

$26.858

$25.515

$24.172

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One Stop Electronics

USA . 714 parts In-Stock

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$34.000

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714

$34.000

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Corphita

USA . 4,893 parts In-Stock

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4,893

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Overview

Elevate your projects with the PAL16L8AMW by Texas Instruments. Crafted with precision and quality, this Programmable Logic Device offers unmatched reliability and performance. Whether you're designing intricate circuitry or optimizing system functionality, this PLD is your go-to solution. With a MILITARY-grade temperature grading and 64 product terms, it provides flexibility and efficiency like no other. Trust in Texas Instruments for cutting-edge technology and innovation, and experience the value and benefits that the PAL16L8AMW brings to your creations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides high reliability and durability for the PLD, ensuring stable performance in various conditions.

Propagation Delay: 30 ns

Fast propagation delay allows for quick processing of signals, making the PLD suitable for time-sensitive applications.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options while ensuring safe operation within specified limits.

Technology Used: TTL

Utilizes TTL technology known for its reliability and compatibility with a wide range of devices.

No. of Inputs: 16

Provides ample input options for versatile programming and customization of the PLD.

Package Shape: RECTANGULAR

Standard shape for easy integration into existing electronic systems.

Form Of Terminal: FLAT

Simplifies connection and soldering processes for efficient assembly.

Architecture: PAL-TYPE

Programmable Array Logic (PAL) architecture offers flexibility and customization options for various applications.

Nominal Supply Voltage (V): 5

Stable supply voltage for consistent and reliable operation of the PLD.

No. of Terminals: 20

Adequate number of terminals for interfacing with external components and peripherals.

Programmable IC Type: OT PLD

Optimal Transistor Programmable Logic Device (OT PLD) offers programmability and versatility in logic functions.

Package Style (Meter): FLATPACK

Flatpack design for space efficiency and compatibility with modern PCB layouts.

Output Function: COMBINATORIAL

Combinatorial output function allows for complex logic operations and versatile circuit designs.

No. of Product Terms: 64

Ample number of product terms for implementing complex logical functions and algorithms.

Minimum Supply Voltage: 4.5 V

Wide operating voltage range allows for compatibility with various power sources.

Maximum Operating Temperature: 125 °C

High operating temperature range for reliability in extreme environmental conditions.

Pitch Of Terminal: 1.27 mm

Standard terminal pitch for easy integration into existing PCB designs.

Organization: 10 DEDICATED INPUTS, 6 I/O

Organized layout with dedicated inputs and I/O lines for efficient programming and customization.

No. of Dedicated Inputs: 10

Dedicated inputs for specific functions or signals, enhancing flexibility and customization options.

Minimum Operating Temperature: -55 °C

Wide operating temperature range for reliable performance in harsh environments or extreme conditions.

Position Of Terminal: DUAL

Dual position terminals for versatile connection options and ease of integration.

No. of Outputs: 8

Sufficient number of outputs for driving external devices or components in a circuit.

No. of I/O Lines: 6

Adequate number of I/O lines for interfacing with external devices or peripherals in a circuit.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures reliability and performance in rugged or demanding applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL16L8AMW attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

Flatpack

Package Code:

DFP

Package Shape:

Package Equivalence Code:

FL20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

R-GDFP-F20

Qualified:

No

Trade Compliance

PAL16L8AMW Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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