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PAL16L8ACFN

Texas Instruments

PAL16L8ACFN by Texas Instruments

PAL16L8ACFN by Texas Instruments is a TTL technology-based PLD with 16 inputs and 8 outputs. It offers a propagation delay of 25 ns, operates at a nominal voltage of 5V, and has a max operating temperature of 70°C. This programmable IC in chip carrier package is ideal for combinatorial output functions in commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,112 parts In-Stock

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Electronic Expediters

USA . 820 parts In-Stock

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820

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Digiode

USA . 584 parts In-Stock

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584

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Distributors (Availability)

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AZTECH Wire

Italy . 556 parts In-Stock

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$14.605

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556

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One Stop Electronics

USA . 1,462 parts In-Stock

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$29.000

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$29.000

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Parana Technologies

USA . 567 parts In-Stock

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$137.532

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$12,771.904

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$123.779

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567

$137.532

$12,771.904

$123.779

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DigiPath Technology Company

USA . 2,183 parts In-Stock

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$151.439

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$151.439

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IDEA Electronic Components Group

UK . 1,735 parts In-Stock

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$154.530

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$146.804

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$139.077

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1,735

$154.530

$146.804

$139.077

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ChromeModa Solutions

Germany . 157 parts In-Stock

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$154.530

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$126.715

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Corphita

USA . 2,975 parts In-Stock

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2,975

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Overview

Elevate the performance of your electronic designs with the PAL16L8ACFN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in their Programmable Logic Devices (PLD). With fast propagation delay and efficient TTL technology, this device offers 16 inputs and 8 outputs for versatile applications. From combinatorial functions to programmable IC types, the PAL16L8ACFN provides value and benefits that exceed expectations. Upgrade your projects today with this reliable and high-performing PLD.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product, making it suitable for a variety of applications.

Propagation Delay: 25 ns

A quick propagation delay of 25 ns ensures efficient operation and fast response times in the PLD.

Surface Mount: YES

Being surface mountable makes installation and integration of the PLD easier and neater, saving space on the PCB.

Technology Used: TTL

TTL technology offers low power consumption and high speed operation, making the PLD energy efficient and responsive.

No. of Inputs: 16

Having 16 inputs allows for more complex logic functions and versatile programming options in the PLD.

Package Shape: SQUARE

The square package shape provides a compact form factor, optimizing space utilization on the circuit board.

Form Of Terminal: J BEND

J bend terminals facilitate easy and secure connections, ensuring reliable performance in the PLD.

Architecture: PAL-TYPE

PAL-type architecture offers flexibility and customization options in programming the PLD for specific applications.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and stable performance.

Power Supplies (V): 5

Having consistent power supplies at 5V contributes to the reliable and efficient operation of the PLD.

No. of Terminals: 20

With 20 terminals available, there are ample connection points for interfacing the PLD with other components in the system.

Programmable IC Type: OT PLD

Being an OT PLD enables the device to be reprogrammable, allowing for flexibility and adaptability in different applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers protection and thermal management for the PLD, enhancing its longevity and reliability.

Output Function: COMBINATORIAL

Combinatorial output function allows for logical operations to be easily implemented in the PLD, expanding its functionality.

No. of Product Terms: 64

Having 64 product terms provides ample resources for implementing complex logic functions and programming sequences in the PLD.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the PLD can withstand moderate heat environments without compromising performance.

Pitch Of Terminal: 1.27 mm

The 1.27mm pitch of terminals allows for standard connections and easy integration of the PLD into existing circuit designs.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures the PLD can function reliably in a wide range of environmental conditions.

Position Of Terminal: QUAD

The quad terminal configuration offers stability and secure connections, enhancing the overall performance of the PLD.

No. of Outputs: 8

Having 8 outputs enables the PLD to drive multiple external components or perform complex logic functions simultaneously.

Grading Of Temperature: COMMERCIAL

Being graded for commercial temperature ranges ensures the PLD is suitable for general purpose applications and everyday use.

Technical Specifications

Programmable Logic Devices (PLD) PAL16L8ACFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

Propagation Delay:

25 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC20,.4SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J20

Qualified:

No

Trade Compliance

PAL16L8ACFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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