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XC95144XL-10TQG100I

Xilinx

XC95144XL-10TQG100I by Xilinx

The Xilinx XC95144XL-10TQG100I is a 144 macrocell FLASH PLD with 81 I/O lines. It operates at a max clock frequency of 138.88 MHz, has propagation delay of 10 ns, and supports JTAG boundary scan test. Ideal for industrial applications requiring high-speed programmable logic devices in compact form factors.

Median Price

$24.345

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Overview

Unlock the power of programmable logic devices with the Xilinx XC95144XL-10TQG100I. Manufactured by industry leader Xilinx, this high-quality PLD offers endless possibilities for customization and optimization in a wide range of applications. With fast propagation delay and versatile surface mounting options, this flash PLD provides customers with exceptional value and performance. Whether you're designing cutting-edge electronics or enhancing existing systems, the XC95144XL-10TQG100I is the perfect solution for your needs. Elevate your projects to the next level with Xilinx's top-of-the-line technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product suitable for a variety of applications.

Propagation Delay: 10 ns

Low propagation delay ensures fast signal processing, which is essential for high-speed digital applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the PLD onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V enables compatibility with a wide range of power sources, increasing flexibility in system design.

No. of Macro Cells: 144

Having 144 macro cells allows for complex logic functions to be implemented, making it suitable for advanced digital designs.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the PLD energy-efficient and reliable in noisy environments.

No. of Inputs: 81

With 81 inputs, the PLD can accommodate a large number of external signals for processing, providing flexibility in system connectivity.

Package Shape: SQUARE

The square package shape is space-efficient and easy to handle during assembly, contributing to overall system compactness.

Form Of Terminal: GULL WING

Gull wing terminals are soldered directly onto PCB pads, ensuring reliable electrical connections and mechanical stability.

Nominal Supply Voltage (V): 3.3

A nominal supply voltage of 3.3 V simplifies system design by providing a common voltage reference for the PLD and connected components.

Power Supplies (V): 2.5/3.3,3.3

Support for multiple power supply options allows for compatibility with various voltage levels in the system, enhancing flexibility in design.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for integrating the PLD into complex circuit layouts, enabling versatile system configurations.

Programmable IC Type: FLASH PLD

Flash PLD technology allows for reprogramming of logic functions without replacing the device, enabling rapid prototyping and field upgrades.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package styles offers a compact form factor suitable for high-density PCB layouts and miniaturized systems.

In-System Programmable: YES

In-system programmability enables on-the-fly configuration changes, facilitating system debugging, testing, and customization without the need for device removal.

Output Function: MACROCELL

Utilizing macrocells for output functions allows for advanced logic operations and signal processing capabilities, enhancing the versatility of the PLD.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3 V ensures reliable operation even under voltage fluctuations, increasing system robustness.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environments or extended operation under elevated temperatures.

Pitch Of Terminal: 0.5 mm

Fine pitch terminals with a spacing of 0.5 mm allow for high-density interconnection within limited PCB real estate, enabling compact and efficient system designs.

Organization: 0 DEDICATED INPUTS, 81 I/O

The organizational structure of having dedicated inputs and 81 I/O lines provides a clear separation for signal routing and processing, simplifying design implementation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature capability ensures reliable functionality even in cold environments, expanding the range of applications for the PLD.

Finishing Of Terminal Used: MATTE TIN

Matte tin finish on terminals offers good solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Position Of Terminal: QUAD

Quad-position terminals provide multiple soldering points for robust electrical connections, reducing the risk of signal interruptions or component failures.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, making the PLD suitable for standard reflow soldering processes with controlled humidity levels.

Maximum Seated Height: 1.6 mm

Low maximum seated height allows for slim profile integration within compact electronic devices, contributing to miniaturization and space-saving.

Width: 14 mm

Compact 14 mm width facilitates easy integration into standard PCB layouts and enclosures, optimizing space utilization in electronic assemblies.

Maximum Clock Frequency: 138.88 MHz

Support for a high maximum clock frequency of 138.88 MHz enables rapid data processing and real-time control in demanding applications, enhancing system performance.

No. of Outputs: 81

Having 81 outputs allows for the parallel processing of multiple signals, expanding the PLD's capability to handle complex logic operations efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature of 30 seconds allows for reliable solder joints during assembly, ensuring robust electrical connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C supports lead-free soldering processes, complying with RoHS regulations and environmental standards.

Length: 14 mm

Compact 14 mm length facilitates space-efficient placement on PCBs and integration within constrained electronic enclosures, contributing to overall system miniaturization.

JTAG Boundary Scan Test: YES

Support for JTAG boundary scan testing enables efficient debugging, testing, and verification of circuit connections, ensuring reliable operation and quick diagnostics.

No. of I/O Lines: 81

With 81 I/O lines, the PLD offers ample connectivity options for interfacing with external devices, sensors, and control components, enhancing system versatility.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature grading ensures reliable performance under demanding operating conditions, making the PLD suitable for industrial automation and control applications.

Technical Specifications

Programmable Logic Devices (PLD) XC95144XL-10TQG100I attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 81 I/O

No. of Outputs:

81

Output Function:

Macrocell

No. of Inputs:

81

No. of Macro Cells:

144

No. of Dedicated Inputs:

0

No. of I/O Lines:

81

Maximum Clock Frequency:

138.88 MHz

Propagation Delay:

10 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

3.3

Minimum Supply Voltage:

3 V

Maximum Supply Voltage:

3.6 V

Power Supplies (V):

2.5/3.3,3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Temprature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Flatpack, Low Profile, Fine Pitch

Package Code:

Package Shape:

Package Equivalence Code:

QFP100,.63SQ,20

Width:

14 mm

Length:

14 mm

Maximum Seated Height:

1.6 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

100

Terminal Pitch:

.5 mm

Terminal Finish:

Matte Tin

Standards

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

XC95144XL-10TQG100I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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