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TGS8632-XCC

Texas Instruments

TGS8632-XCC by Texas Instruments

TGS8632-XCC by Texas Instruments is an RF/Microwave SPST switch with 30 dBm CW power, 1.5 VSWR, and 0-18000 MHz frequency range. Ideal for applications requiring high-frequency signal routing in communication systems or test equipment.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,166 parts In-Stock

1+ parts

-

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2,166

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Digiode

USA . 868 parts In-Stock

1+ parts

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868

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 81 parts In-Stock

1+ parts

$0.783

100+ parts

-

1k+ parts

$1.772

10k+ parts

-

81

$0.783

-

$1.772

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DigiPath Technology Company

USA . 1,063 parts In-Stock

1+ parts

$0.862

100+ parts

$0.793

1k+ parts

-

10k+ parts

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1,063

$0.862

$0.793

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ChromeModa Solutions

Germany . 3,037 parts In-Stock

1+ parts

$0.880

100+ parts

$0.722

1k+ parts

-

10k+ parts

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3,037

$0.880

$0.722

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IDEA Electronic Components Group

UK . 1,511 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

$0.792

10k+ parts

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1,511

$0.880

-

$0.792

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AZTECH Wire

Italy . 629 parts In-Stock

1+ parts

$15.164

100+ parts

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629

$15.164

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Ampacity Inc.

Singapore . 760 parts In-Stock

1+ parts

$32.000

100+ parts

-

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760

$32.000

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One Stop Electronics

USA . 963 parts In-Stock

1+ parts

$37.000

100+ parts

-

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963

$37.000

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Semicontronic

India . 429 parts In-Stock

1+ parts

$38.000

100+ parts

$37.050

1k+ parts

$36.860

10k+ parts

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429

$38.000

$37.050

$36.860

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Corphita

USA . 3,900 parts In-Stock

1+ parts

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3,900

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Corohmni

South Africa . 278 parts In-Stock

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278

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Overview

Experience the superior quality and performance of the TGS8632-XCC RF/Microwave Switch by Texas Instruments. Known for their innovative technology and reliable products, Texas Instruments delivers excellence in every component they create. The TGS8632-XCC is ideal for a wide range of applications, offering unmatched precision and efficiency. Whether you're in need of a SPST switch for your RF or microwave devices, this product provides exceptional value and benefits that will elevate your projects to new heights. Trust Texas Instruments for all your RF/Microwave needs and experience the difference in quality.

Feature Benefit Bullets

Maximum Input Power (CW): 30 dBm

With a high maximum input power of 30 dBm, this RF/Microwave switch can handle higher power levels without risk of damage, providing reliable performance in demanding applications.

Maximum Voltage Standing Wave Ratio: 1.5

The low VSWR of 1.5 ensures efficient power transfer and minimal signal reflection, leading to improved signal quality and overall system performance.

Construction: COMPONENT

Being a COMPONENT construction, this switch offers versatility in integration and customization within larger systems, allowing for tailored solutions to specific RF/microwave requirements.

RF or Microwave Device Type: SPST

As a Single-Pole, Single-Throw (SPST) device type, this switch provides a simple, yet reliable configuration for basic RF/microwave signal routing applications, making it suitable for various setups.

Minimum Operating Frequency: 0 MHz

With a starting frequency of 0 MHz, this switch is capable of handling a wide range of frequencies, making it versatile for use in diverse RF/microwave systems.

Maximum Operating Frequency: 18000 MHz

Featuring a high maximum frequency of 18000 MHz, this switch can support signals in the microwave range, making it suitable for applications requiring higher frequency operation.

Technical Specifications

RF/Microwave Switches TGS8632-XCC attributes and parameters. Explore more RF/Microwave Switches devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE

Construction:

COMPONENT

Maximum Input Power (CW):

30 dBm

Maximum Operating Frequency:

18000 MHz

Minimum Operating Frequency:

0 MHz

RF or Microwave Device Type:

Maximum Voltage Standing Wave Ratio:

1.5

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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