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SNJ54ABT8996JT

Texas Instruments

SNJ54ABT8996JT by Texas Instruments

SNJ54ABT8996JT by Texas Instruments is a MILITARY-grade MICROPROCESSOR CIRCUIT with BICMOS technology. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V, drawing a max current of 18mA. Ideal for applications requiring high reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,788 parts In-Stock

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3,788

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Digiode

USA . 1,395 parts In-Stock

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1,395

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Distributors (Availability)

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AZTECH Wire

Italy . 718 parts In-Stock

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$5.583

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718

$5.583

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One Stop Electronics

USA . 1,042 parts In-Stock

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$8.000

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$8.000

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Corohmni

South Africa . 5,218 parts In-Stock

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$43.685

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$43.685

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Parana Technologies

USA . 1,617 parts In-Stock

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$44.490

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$4,131.591

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$40.041

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1,617

$44.490

$4,131.591

$40.041

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DigiPath Technology Company

USA . 916 parts In-Stock

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$48.989

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916

$48.989

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ChromeModa Solutions

Germany . 5,937 parts In-Stock

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$49.989

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$40.991

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5,937

$49.989

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IDEA Electronic Components Group

UK . 1,813 parts In-Stock

1+ parts

$49.989

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$47.490

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$44.990

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1,813

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Corphita

USA . 261 parts In-Stock

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Overview

Unlock the full potential of your electronic devices with the SNJ54ABT8996JT by Texas Instruments. This high-quality microprocessor circuit offers unparalleled performance and reliability, thanks to its MILITARY-grade technology and rigorous screening process. Perfect for a wide range of applications, this IC provides customers with a seamless experience and peace of mind knowing they are using a top-tier product. Upgrade your devices today with the SNJ54ABT8996JT and experience the difference.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent protection and reliability for the integrated circuits within the package.

Maximum Supply Voltage: 5.5 V

Allows for a higher maximum supply voltage, providing flexibility in power supply options.

Screening Level: MIL-PRF-38535

Meets military screening standards for reliability and quality control.

Package Shape: RECTANGULAR

Efficient use of space and easy integration into circuit designs.

Power Supplies (V): 5

Matches common power supply voltages, making it compatible with a wide range of applications.

No. of Terminals: 24

Provides ample connectivity options for diverse circuit configurations.

Package Style (Meter): IN-LINE

Simplifies PCB layout and assembly processes.

Minimum Supply Voltage: 4.5 V

Allows for operation with relatively low supply voltage, conserving power.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments or applications that require extended operation at elevated temperatures.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold conditions without performance degradation.

Terminal Position: DUAL

Facilitates easier connection and soldering of the package onto circuit boards.

Maximum Seated Height: 5.08 mm

Compact size for space-constrained designs.

Width: 7.62 mm

Narrow profile allows for efficient use of board space.

Length: 32.005 mm

Optimal dimensions for various applications while providing necessary connectivity.

Temperature Grade: MILITARY

Designed to meet rigorous military standards for performance and reliability in harsh environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes advanced processing capabilities for enhanced functionality in embedded systems.

Technology: BICMOS

Combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: THROUGH-HOLE

Suitable for traditional PCB assembly methods and offers mechanical strength.

Maximum Supply Current: 18 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 5 V

Matches standard voltage requirements for widespread compatibility.

Terminal Pitch: 2.54 mm

Standard spacing for easier integration into existing circuit layouts.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SNJ54ABT8996JT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-GDIP-T24

Length:

32.005 mm

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

SNJ54ABT8996JT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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