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SNJ54ACT8999FK

Texas Instruments

SNJ54ACT8999FK by Texas Instruments

SNJ54ACT8999FK by Texas Instruments is a CMOS microprocessor circuit with 28 terminals, operating b/w -55 to 125°C. It has a supply voltage range of 4.5V to 5.5V and is MILITARY grade screened for reliability. This chip carrier package is ideal for applications requiring high-temperature performance in military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,995 parts In-Stock

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Digiode

USA . 2,937 parts In-Stock

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2,937

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Distributors (Availability)

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AZTECH Wire

Italy . 390 parts In-Stock

1+ parts

$18.378

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390

$18.378

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One Stop Electronics

USA . 455 parts In-Stock

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$22.000

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$22.000

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Corohmni

South Africa . 660 parts In-Stock

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$65.393

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660

$65.393

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Parana Technologies

USA . 2,200 parts In-Stock

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$67.341

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$67.341

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DigiPath Technology Company

USA . 1,631 parts In-Stock

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$74.151

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1,631

$74.151

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ChromeModa Solutions

Germany . 6,251 parts In-Stock

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$75.664

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$62.044

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$75.664

$62.044

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IDEA Electronic Components Group

UK . 2,046 parts In-Stock

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$75.664

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$71.881

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$68.098

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2,046

$75.664

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$68.098

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Corphita

USA . 3,321 parts In-Stock

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Overview

Elevate your electronic designs with the SNJ54ACT8999FK from Texas Instruments. Known for their superior quality and expertise in semiconductor manufacturing, Texas Instruments offers an unrivaled range of applications in the category of Other Function uPs, uCs & Peripheral ICs. This product boasts a package body material of CERAMIC, METAL-SEALED COFIRED, ensuring durability and reliability. With a maximum supply voltage of 5.5V and a wide operating temperature range, this chip carrier package delivers exceptional performance in military-grade applications. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and adds value to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and compatibility with a variety of systems.

Screening Level: 38535Q/M;38534H;883B

Meets high-quality standard specifications for reliable performance.

Package Shape: SQUARE

Compact design that optimizes space on the circuit board.

Power Supplies (V): 5

Standard power supply voltage for compatibility with many applications.

No. of Terminals: 28

Offers multiple connection points for versatile connectivity.

Package Style (Meter): CHIP CARRIER

Ensures efficient heat dissipation and compact form factor.

Minimum Supply Voltage: 4.5 V

Provides a range of voltage options for different power supply configurations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold conditions without performance issues.

Terminal Position: QUAD

Allows for easy connection and integration with other components in the circuit.

Maximum Seated Height: 2.03 mm

Low profile design for compact and space-efficient system integration.

Width: 11.43 mm

Optimal dimensions for fitting into tight spaces on the PCB.

Length: 11.43 mm

Compact size that contributes to overall system miniaturization.

Temperature Grade: MILITARY

Meets stringent military standards for reliability in demanding environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Provides advanced processing capabilities for efficient system operation.

Technology: CMOS

Utilizes low power consumption and offers high noise immunity for reliable performance.

Terminal Form: NO LEAD

Lead-free design for environmentally friendly and RoHS-compliant manufacturing.

Nominal Supply Voltage: 5 V

Stable voltage supply for consistent and reliable operation.

Terminal Pitch: 1.27 mm

Standardized pitch for easy integration into various circuit designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SNJ54ACT8999FK attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.03 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.43 mm

Peripheral IC Type:

Trade Compliance

SNJ54ACT8999FK Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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