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SNJ54ABT8996FK

Texas Instruments

SNJ54ABT8996FK by Texas Instruments

SNJ54ABT8996FK by Texas Instruments is a MIL-PRF-38535 screened BICMOS microprocessor circuit with 28 terminals. It operates b/w -55 to 125 °C, with supply voltage range of 4.5V to 5.5V and max current draw of 18mA. Ideal for military-grade applications requiring high reliability and performance in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,531 parts In-Stock

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Digiode

USA . 3,322 parts In-Stock

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3,322

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AZTECH Wire

Italy . 337 parts In-Stock

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$7.510

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337

$7.510

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Corohmni

South Africa . 80 parts In-Stock

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$24.902

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$24.902

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One Stop Electronics

USA . 411 parts In-Stock

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$29.000

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Parana Technologies

USA . 932 parts In-Stock

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$53.930

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932

$53.930

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ChromeModa Solutions

Germany . 5,166 parts In-Stock

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$60.596

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$49.689

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$60.596

$49.689

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IDEA Electronic Components Group

UK . 410 parts In-Stock

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$60.596

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$57.566

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$54.536

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410

$60.596

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Corphita

USA . 2,011 parts In-Stock

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DigiPath Technology Company

USA . 1,341 parts In-Stock

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$54.633

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Overview

Unlock the power of cutting-edge technology with the SNJ54ABT8996FK by Texas Instruments. Designed with precision and reliability in mind, this versatile microprocessor circuit offers unparalleled performance in a variety of applications. From automotive to industrial automation, this high-quality chip carrier delivers exceptional functionality and efficiency. With a nominal supply voltage of 5V and a maximum operating temperature of 125°C, this MILITARY-grade component is a game-changer for your next project. Experience the difference with Texas Instruments and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material provides excellent protection and durability for the internal components, ensuring reliable performance in various environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and enabling streamlined assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V enables the circuit to handle higher power requirements and voltages, making it versatile for a wide range of applications.

Screening Level: MIL-PRF-38535

MIL-PRF-38535 screening ensures that the product meets rigorous military standards for quality and reliability, making it suitable for critical applications where performance is essential.

Package Shape: SQUARE

The square package shape allows for more efficient use of space on the circuit board, making it ideal for compact designs and integration into tight layouts.

Power Supplies (V): 5

With a nominal supply voltage of 5V, this product is compatible with standard power sources, making it easy to integrate into existing systems and designs.

No. of Terminals: 28

The 28 terminals provide ample connectivity options, allowing for versatile configurations and connections to other components in the system.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and robust form factor, suitable for high-density mounting and optimal heat dissipation.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5V ensures compatibility with a wide range of power sources, providing flexibility in system design and operation.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high-temperature environments and perform reliably under demanding conditions.

Minimum Operating Temperature: -55 °C

The minimum operating temperature of -55°C allows the product to function effectively in extreme cold conditions, making it suitable for a diverse range of operating environments.

Terminal Position: QUAD

The quad terminal position offers enhanced stability and secure connections, minimizing the risk of signal loss or interference in the circuit.

Maximum Seated Height: 2.03 mm

The low maximum seated height of 2.03mm enables a compact and space-saving design, facilitating efficient installation and integration into tight spaces.

Width: 11.43 mm

The width of 11.43mm provides a suitable form factor for various electronic applications, allowing for easy placement on standard-sized circuit boards.

Length: 11.43 mm

With a length of 11.43mm, this product offers a balanced size profile, making it versatile for different system configurations and layouts.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the product can operate reliably in harsh temperature conditions, meeting stringent performance requirements for mission-critical applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC enhances the functionality and processing capabilities of the product, enabling advanced control and computation tasks.

Technology: BICMOS

The use of BICMOS technology offers a combination of bipolar and CMOS advantages, providing high-speed operation, low power consumption, and improved noise immunity for efficient performance.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and enhances reliability, reducing the risk of solder joint failures and ensuring stable connections in the circuit.

Maximum Supply Current: 18 mA

The low maximum supply current of 18mA minimizes power consumption, making the product energy-efficient and suitable for battery-powered devices or applications with strict power requirements.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying integration and offering reliable performance in a variety of operating conditions.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for precise and secure connections, facilitating easy interfacing with other components and ensuring robust electrical connections in the system.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SNJ54ABT8996FK attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.43 mm

Peripheral IC Type:

Trade Compliance

SNJ54ABT8996FK Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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