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SNJ54AS856FH

Texas Instruments

SNJ54AS856FH by Texas Instruments

SNJ54AS856FH by Texas Instruments is a MILITARY-grade TTL IC with 28 terminals in a CHIP CARRIER package. It operates b/w -55°C to 125°C, suitable for harsh environments. Ideal for applications requiring high reliability and performance in aerospace or defense systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,469 parts In-Stock

1+ parts

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5,469

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Digiode

USA . 4,065 parts In-Stock

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4,065

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 697 parts In-Stock

1+ parts

$15.022

100+ parts

-

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697

$15.022

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One Stop Electronics

USA . 1,556 parts In-Stock

1+ parts

$35.000

100+ parts

-

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1,556

$35.000

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Parana Technologies

USA . 925 parts In-Stock

1+ parts

$35.280

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925

$35.280

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DigiPath Technology Company

USA . 921 parts In-Stock

1+ parts

$38.848

100+ parts

$35.740

1k+ parts

-

10k+ parts

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921

$38.848

$35.740

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ChromeModa Solutions

Germany . 3,611 parts In-Stock

1+ parts

$39.641

100+ parts

$32.506

1k+ parts

-

10k+ parts

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3,611

$39.641

$32.506

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IDEA Electronic Components Group

UK . 1,587 parts In-Stock

1+ parts

$39.641

100+ parts

$37.659

1k+ parts

$35.677

10k+ parts

-

1,587

$39.641

$37.659

$35.677

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Corohmni

South Africa . 489 parts In-Stock

1+ parts

$45.695

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489

$45.695

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Corphita

USA . 2,107 parts In-Stock

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2,107

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Overview

Discover the unparalleled quality and reliability of the SNJ54AS856FH by Texas Instruments, a leading manufacturer in the industry. This versatile IC falls under the category of Other Function uPs,uCs & Peripheral ICs, making it suitable for a wide range of applications. With its durable ceramic package body material and military-grade temperature grade, this product ensures optimal performance in harsh environments. Experience the value and benefits of this chip carrier style IC, offering customers unmatched efficiency and functionality. Elevate your projects with the SNJ54AS856FH and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity and electrical insulation properties, making it an excellent choice for electronic components that require efficient heat dissipation and protection against electrical interference.

Surface Mount: YES

Surface mount technology allows for compact and lightweight designs, making the product suitable for applications where space is limited and weight needs to be minimized.

Screening Level: 38535Q/M;38534H;883B

This indicates that the product has been subjected to rigorous testing and quality control processes, ensuring high reliability and performance in demanding military applications.

Package Shape: SQUARE

Square packages are easier to handle and provide better thermal characteristics compared to other shapes, enhancing the overall durability and efficiency of the product.

No. of Terminals: 28

Having a sufficient number of terminals allows for versatile connectivity options and integration with other components, making the product suitable for complex circuit designs.

Package Style: CHIP CARRIER

Chip carrier packages offer superior protection for the internal circuitry, reducing the risk of damage from external factors and ensuring long-term durability in harsh operating environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand elevated temperatures without compromising performance, making it suitable for applications where heat dissipation is a concern.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable performance even in extremely cold environments, making the product versatile and suitable for a wide range of operating conditions.

Temperature Grade: MILITARY

Meeting military-grade standards ensures that the product can operate effectively in harsh environmental conditions, making it a reliable choice for military and defense applications.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making the product efficient and suitable for applications where precise timing and energy efficiency are essential.

Terminal Pitch: 1.27 mm

Having a small terminal pitch allows for high-density mounting and compact circuit designs, making the product ideal for applications where space-saving is a priority.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SNJ54AS856FH attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N28

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Microprocessor ICs

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ54AS856FH Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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