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SN74V3690-7PEU

Texas Instruments

SN74V3690-7PEU by Texas Instruments

SN74V3690-7PEU by Texas Instruments is a FIFO memory with 32Kx36 organization, operating at 133.3 MHz clock frequency and 7.5 ns cycle time. It is suitable for applications requiring fast synchronous data storage and retrieval in commercial temperature environments.

Median Price

$22.510

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 736 parts In-Stock

1+ parts

-

100+ parts

$19.480

1k+ parts

$17.430

10k+ parts

$16.400

736

-

$19.480

$17.430

$16.400

DigiKey

USA . 736 parts In-Stock

1+ parts

-

100+ parts

$22.510

1k+ parts

-

10k+ parts

-

736

-

$22.510

-

-

Verical

USA . 379 parts In-Stock

1+ parts

-

100+ parts

$24.350

1k+ parts

$21.788

10k+ parts

$20.500

379

-

$24.350

$21.788

$20.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 326 parts In-Stock

1+ parts

$20.558

100+ parts

-

1k+ parts

-

10k+ parts

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326

$20.558

-

-

-

Vyrian

USA . 4,299 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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4,299

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-

-

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DigiKey Marketplace

USA . 736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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736

-

-

-

-

Electronics Depot

USA . 12 parts In-Stock

1+ parts

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12

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Sunrise Surplus Inc.

USA . 3 parts In-Stock

1+ parts

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,807 parts In-Stock

1+ parts

$3.524

100+ parts

-

1k+ parts

$4.048

10k+ parts

-

1,807

$3.524

-

$4.048

-

ChromeModa Solutions

Germany . 2,491 parts In-Stock

1+ parts

$3.960

100+ parts

$3.247

1k+ parts

-

10k+ parts

-

2,491

$3.960

$3.247

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-

IDEA Electronic Components Group

UK . 1,206 parts In-Stock

1+ parts

$3.960

100+ parts

-

1k+ parts

$3.564

10k+ parts

-

1,206

$3.960

-

$3.564

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Corphita

USA . 3,363 parts In-Stock

1+ parts

$19.476

100+ parts

-

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10k+ parts

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3,363

$19.476

-

-

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DigiPath Technology Company

USA . 1,866 parts In-Stock

1+ parts

-

100+ parts

$3.570

1k+ parts

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10k+ parts

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1,866

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$3.570

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Microchip USA

USA . 465 parts In-Stock

1+ parts

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465

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Overview

Enhance your electronic projects with the SN74V3690-7PEU FIFO from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. This FIFO device offers seamless data storage and retrieval, making it ideal for applications requiring fast and efficient data handling. With a nominal supply voltage of 3.3V and a maximum clock frequency of 133.3 MHz, this versatile component is a valuable addition to any design. Upgrade your system performance with the SN74V3690-7PEU and experience the benefits of Texas Instruments' innovation firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the FIFO, making it suitable for various environments.

Cycle Time: 7.5 ns

The fast cycle time of 7.5 ns allows for quick data transfer and processing, making the FIFO efficient for high-speed applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures that data is transferred and synchronized with the clock signal, reducing the chance of data loss or errors.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V provides a balance between power consumption and performance for the FIFO.

Memory Density: 1179648 bit

With a high memory density of 1179648 bits, this FIFO can store a large amount of data efficiently, making it suitable for data-intensive applications.

Technical Specifications

FIFO SN74V3690-7PEU attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

5 ns

Maximum Clock Frequency (fCLK):

133.3 MHz

Cycle Time:

7.5 ns

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Memory Density:

1179648 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

128

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

220

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

14 mm

Trade Compliance

SN74V3690-7PEU Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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