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SN74V3680-7PEU

Texas Instruments

SN74V3680-7PEU by Texas Instruments

SN74V3680-7PEU by Texas Instruments is a FIFO with 16Kx36 organization, operating at 133.3 MHz clock frequency and 7.5 ns cycle time. It is ideal for applications requiring fast synchronous data transfer in commercial temperature environments.

Median Price

$21.140

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 119 parts In-Stock

1+ parts

$21.140

100+ parts

$19.870

1k+ parts

$17.970

10k+ parts

-

119

$21.140

$19.870

$17.970

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,146 parts In-Stock

1+ parts

$20.083

100+ parts

-

1k+ parts

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10k+ parts

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1,146

$20.083

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Vyrian

USA . 4,237 parts In-Stock

1+ parts

-

100+ parts

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4,237

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DigiKey Marketplace

USA . 44 parts In-Stock

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44

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 43 parts In-Stock

1+ parts

$4.992

100+ parts

$463.584

1k+ parts

$4.493

10k+ parts

-

43

$4.992

$463.584

$4.493

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DigiPath Technology Company

USA . 2,048 parts In-Stock

1+ parts

$5.497

100+ parts

-

1k+ parts

-

10k+ parts

-

2,048

$5.497

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-

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ChromeModa Solutions

Germany . 6,047 parts In-Stock

1+ parts

$5.609

100+ parts

$4.599

1k+ parts

-

10k+ parts

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6,047

$5.609

$4.599

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IDEA Electronic Components Group

UK . 2,067 parts In-Stock

1+ parts

$5.609

100+ parts

-

1k+ parts

$5.048

10k+ parts

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2,067

$5.609

-

$5.048

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AZTECH Wire

Italy . 235 parts In-Stock

1+ parts

$14.640

100+ parts

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235

$14.640

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Ampacity Inc.

Singapore . 107 parts In-Stock

1+ parts

$17.970

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107

$17.970

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Corphita

USA . 2,559 parts In-Stock

1+ parts

$19.026

100+ parts

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2,559

$19.026

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Microchip USA

USA . 295 parts In-Stock

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295

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Overview

Enhance your electronic projects with the high-quality SN74V3680-7PEU FIFO by Texas Instruments. Designed for efficiency and reliability, this FIFO category product offers seamless data storage and retrieval, making it ideal for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product delivers exceptional performance. Unlock the value and benefits of this innovative solution today and experience the advantages it brings to your projects. Elevate your designs with the SN74V3680-7PEU and achieve optimal results with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable or rugged applications.

Cycle Time: 7.5 ns

The fast cycle time of 7.5 ns ensures quick data processing and efficient operation of the FIFO, making it suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes the product compatible with standard voltage levels, resulting in easy integration into existing systems.

Maximum Clock Frequency (fCLK): 133.3 MHz

With a maximum clock frequency of 133.3 MHz, the FIFO can handle high-speed data transfer and processing, making it suitable for demanding applications.

Memory Density: 589824 bit

The high memory density of 589824 bit allows for storing a large amount of data in the FIFO, making it suitable for applications requiring extensive memory storage.

Output Enable: YES

The output enable feature allows for the control of data output from the FIFO, providing flexibility in data retrieval and enhancing overall system performance.

Technical Specifications

FIFO SN74V3680-7PEU attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

5 ns

Maximum Clock Frequency (fCLK):

133.3 MHz

Cycle Time:

7.5 ns

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Memory Density:

589824 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

128

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

220

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

14 mm

Trade Compliance

SN74V3680-7PEU Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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