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SN74S225N3

Texas Instruments

SN74S225N3 by Texas Instruments

SN74S225N3 by Texas Instruments is a 16x5 FIFO memory IC with 100ns cycle time, operating at 5V. It has a max clock frequency of 10MHz and can store up to 80 bits. Ideal for applications requiring fast synchronous data storage and retrieval in commercial temperature environments.

Median Price

$1.813

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 375 parts In-Stock

1+ parts

-

100+ parts

$1.620

1k+ parts

$1.450

10k+ parts

$1.360

375

-

$1.620

$1.450

$1.360

DigiKey

USA . 375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.130

10k+ parts

-

375

-

-

$2.130

-

Verical

USA . 375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.813

10k+ parts

$1.700

375

-

-

$1.813

$1.700

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,054 parts In-Stock

1+ parts

$1.700

100+ parts

-

1k+ parts

-

10k+ parts

-

1,054

$1.700

-

-

-

Vyrian

USA . 5,422 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,422

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,536 parts In-Stock

1+ parts

$1.611

100+ parts

-

1k+ parts

-

10k+ parts

-

2,536

$1.611

-

-

-

Parana Technologies

USA . 1,577 parts In-Stock

1+ parts

$3.744

100+ parts

-

1k+ parts

$4.243

10k+ parts

-

1,577

$3.744

-

$4.243

-

DigiPath Technology Company

USA . 1,610 parts In-Stock

1+ parts

$4.123

100+ parts

$3.793

1k+ parts

-

10k+ parts

-

1,610

$4.123

$3.793

-

-

ChromeModa Solutions

Germany . 4,710 parts In-Stock

1+ parts

$4.207

100+ parts

$3.450

1k+ parts

-

10k+ parts

-

4,710

$4.207

$3.450

-

-

IDEA Electronic Components Group

UK . 1,515 parts In-Stock

1+ parts

$4.207

100+ parts

-

1k+ parts

$3.786

10k+ parts

-

1,515

$4.207

-

$3.786

-

Overview

Enhance your electronic projects with the high-quality SN74S225N3 FIFO by Texas Instruments. This innovative product offers reliable performance, optimal functionality, and seamless integration for a wide range of applications. With Texas Instruments' reputable manufacturing standards, you can trust in the value and benefits this FIFO brings to your designs. Upgrade your systems with the SN74S225N3 and experience improved efficiency and precision like never before. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FIFO, making it a reliable choice for long-term use.

Cycle Time: 100 ns

The fast cycle time of 100 ns ensures efficient operation and quick data processing, making this FIFO suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures that data transfers within the FIFO occur in a synchronized manner, improving overall system performance and reliability.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power supplies, making integration of this FIFO into existing systems easy and straightforward.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the FIFO to operate reliably in a wide range of environmental conditions, increasing its versatility and applicability.

No. of Words: 16 words

With a capacity of 16 words, this FIFO can store and process a sufficient amount of data, making it suitable for various data buffering and processing applications.

Maximum Clock Frequency (fCLK): 10 MHz

The maximum clock frequency of 10 MHz allows for fast data transfer rates and efficient operation, making this FIFO ideal for high-performance systems.

Memory IC Type: OTHER FIFO

The memory IC type of 'OTHER FIFO' indicates that this FIFO is specifically designed for memory storage and retrieval applications, making it a specialized and reliable choice for memory-intensive tasks.

Output Enable: YES

The output enable feature allows for greater control over data output from the FIFO, enabling more flexible and efficient data processing within the system.

Maximum Access Time: 75 ns

The fast maximum access time of 75 ns ensures quick retrieval of data from the FIFO, reducing latency and improving overall system performance.

Technical Specifications

FIFO SN74S225N3 attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

75 ns

Maximum Clock Frequency (fCLK):

10 MHz

Cycle Time:

100 ns

JESD-30 Code:

R-PDIP-T20

Length:

25.4 mm

Memory Density:

80 bit

Memory IC Type:

Memory Width:

5

No. of Functions:

1

No. of Terminals:

20

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16X5

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74S225N3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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