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SN74HC11DRG4

Texas Instruments

SN74HC11DRG4 by Texas Instruments

SN74HC11DRG4 by Texas Instruments is a logic gate with 3 functions and inputs, operating at 5V. It has a propagation delay of 25ns and can handle a load capacitance of 50pF. This CMOS technology device is ideal for industrial applications requiring fast signal processing in small outline packages.

Median Price

$0.208

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,665 parts In-Stock

1+ parts

-

100+ parts

$0.216

1k+ parts

$0.179

10k+ parts

$0.160

2,665

-

$0.216

$0.179

$0.160

Verical

USA . 2,665 parts In-Stock

1+ parts

-

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$0.199

2,665

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$0.199

Distributors (In-Stock)

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Nova Conductors

Japan . 55 parts In-Stock

1+ parts

$0.090

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-

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55

$0.090

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Digiode

USA . 2,568 parts In-Stock

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$0.095

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2,568

$0.095

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Bristol Electronics

USA . 1,580 parts In-Stock

1+ parts

$0.750

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$0.375

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$0.150

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1,580

$0.750

$0.375

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Chip Stock

USA . 30,370 parts In-Stock

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Vyrian

USA . 2,596 parts In-Stock

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Microfarads

USA . 1,525 parts In-Stock

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Component Sense

UK . 1,440 parts In-Stock

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EMSNET

USA . 625 parts In-Stock

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625

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,422 parts In-Stock

1+ parts

$0.085

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-

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$0.085

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Continental Prestige Electronics

USA . 2,201 parts In-Stock

1+ parts

$0.089

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$0.088

2,201

$0.089

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$0.088

Argo Parts USA

USA . 798 parts In-Stock

1+ parts

$0.089

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-

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$0.087

798

$0.089

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$0.087

Netroflash

USA . 100 parts In-Stock

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$0.090

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$0.088

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100

$0.090

$0.088

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Corphita

USA . 4,976 parts In-Stock

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$0.090

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AZTECH Wire

Italy . 601 parts In-Stock

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$12.760

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$12.760

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Parana Technologies

USA . 2,358 parts In-Stock

1+ parts

$16.909

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$17.146

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2,358

$16.909

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$17.146

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DigiPath Technology Company

USA . 1,525 parts In-Stock

1+ parts

$18.619

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$17.129

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1,525

$18.619

$17.129

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ChromeModa Solutions

Germany . 6,976 parts In-Stock

1+ parts

$18.999

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$15.579

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6,976

$18.999

$15.579

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IDEA Electronic Components Group

UK . 908 parts In-Stock

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$18.999

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$18.049

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$17.099

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908

$18.999

$18.049

$17.099

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Corohmni

South Africa . 363 parts In-Stock

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$29.627

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Perfect Parts

USA . 4,807 parts In-Stock

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4,807

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Infinite Electronics LLP (Excess)

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Microchip USA

USA . 491 parts In-Stock

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491

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Overview

Unlock the power of high-quality logic gates with the SN74HC11DRG4 by Texas Instruments. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers reliable components that excel in various applications. The SN74HC11DRG4 offers customers exceptional value with its fast propagation delay and versatile design, making it ideal for a wide range of electronic projects. Experience the benefits of Texas Instrument's expertise and trust in the quality of the SN74HC11DRG4 for your next project.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Propagation Delay At Nominal Supply:

25 ns - Offers fast signal processing.

Surface Mount:

YES - Allows for easy and compact mounting on PCBs.

No. of Functions:

3 - Provides versatility in circuit design.

No. of Inputs:

3 - Suitable for applications requiring multiple input signals.

Package Shape:

RECTANGULAR - Fits well with standard PCB layouts.

Nominal Supply Voltage / Vsup:

5V - Compatible with common power sources.

Load Capacitance (CL):

50 pF - Ensures stable operation in various conditions.

Power Supplies (V):

2/6 - Offers flexibility in power options.

No. of Terminals:

14 - Allows for connectivity with other components.

Package Style (Meter):

SMALL OUTLINE - Saves space in compact designs.

Maximum I (ol):

5.2 Amp - Handles high current loads effectively.

Propagation Delay (tpd):

125 ns - Balances speed and efficiency.

Maximum Operating Temperature:

85 °C - Suitable for industrial use.

Minimum Operating Temperature:

40 °C - Can withstand harsh environments.

Terminal Finish:

MATTE TIN - Provides good solderability and conductivity.

Terminal Position:

DUAL - Facilitates easy PCB mounting.

Maximum Seated Height:

1.75 mm - Enables low-profile applications.

Width:

3.9 mm - Fits well in constrained spaces.

Minimum Supply Voltage (Vsup):

2V - Works efficiently with low power sources.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures reliable solder joints during assembly.

Peak Reflow Temperature °C:

260 - Compatible with standard reflow processes.

Length:

8.65 mm - Allows for flexibility in PCB layout.

Temperature Grade:

INDUSTRIAL - Meets industry standards for temperature range.

Technology:

CMOS - Offers low power consumption and high noise immunity.

Terminal Form:

GULL WING - Provides secure electrical connections.

Packing Method:

TR - Facilitates easy handling and storage.

Terminal Pitch:

1.27 mm - Allows for convenient PCB layout.

Maximum Supply Voltage (Vsup):

6V - Handles higher voltage requirements.

Maximum Power Supply Current (ICC):

0.02 mA - Ensures efficient power usage.

Technical Specifications

Logic Gates SN74HC11DRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

25 ns

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74HC11DRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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