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SN74HC11DR

Texas Instruments

SN74HC11DR by Texas Instruments

SN74HC11DR by Texas Instruments is a logic gate with 3 functions and inputs, operating at a supply voltage of 5V. It has a propagation delay of 25ns and can handle load capacitance up to 50pF. This CMOS technology device is ideal for industrial applications requiring fast signal processing in compact designs.

Median Price

$0.199

Lifecycle Status

Suppliers In-Stock

35

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 74,917 parts In-Stock

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Mouser Electronics

USA . 3,311 parts In-Stock

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$0.430

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$0.230

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3,311

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Rochester

USA . 41,530 parts In-Stock

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$0.216

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$0.179

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41,530

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$0.160

DigiKey

USA . 41,530 parts In-Stock

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$0.270

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Verical

USA . 18,670 parts In-Stock

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Arrow

USA . 2,500 parts In-Stock

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Chip1Stop

Japan . 1,825 parts In-Stock

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$0.084

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Distributors (In-Stock)

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Digiode

USA . 2,890 parts In-Stock

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$0.066

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DF Sales Co.

USA . 650 parts In-Stock

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$0.160

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DF Sales Co.

USA . 650 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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TME

Poland . 2,134 parts In-Stock

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Bristol Electronics

USA . 6,277 parts In-Stock

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$0.468

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$0.234

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$0.094

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$0.070

6,277

$0.468

$0.234

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$0.070

Maritex

Poland . 1,170 parts In-Stock

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$0.942

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$0.216

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$0.146

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Component Electronics Inc.

Canada . 197 parts In-Stock

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$1.540

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$1.150

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Chip Stock

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Vyrian

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Semtec, LLC

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Dan-Mar Components

USA . 6,277 parts In-Stock

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ECAB

Sweden . 5,215 parts In-Stock

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Resion

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Sensible Micro Corp

USA . 2,936 parts In-Stock

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Sea View Technologies

USA . 2,723 parts In-Stock

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Inland Empire Components Inc.

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Cyclops Electronics Ltd

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Flex Direct, LLC

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Micros

Poland . 1,000 parts In-Stock

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Partservice

France . 980 parts In-Stock

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$0.098

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Micros sp.j. W. Kędra i J. Lic

Poland . 980 parts In-Stock

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Microfarads

USA . 917 parts In-Stock

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Holdelec - ElecDif-Pro

France . 281 parts In-Stock

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Component Sense

UK . 141 parts In-Stock

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North Shore Components

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ComSIT Distribution GmbH

Germany . 21 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 26,815 parts In-Stock

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$0.060

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$0.058

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$0.058

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26,815

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Ampacity Inc.

Singapore . 24,281 parts In-Stock

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Corphita

USA . 4,973 parts In-Stock

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Argo Parts USA

USA . 2,914 parts In-Stock

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$0.165

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$0.160

2,914

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Continental Prestige Electronics

USA . 1,635 parts In-Stock

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$0.165

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$0.161

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Microchip USA

USA . 3,385 parts In-Stock

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$0.950

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Parana Technologies

USA . 412 parts In-Stock

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$21.302

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$21.621

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DigiPath Technology Company

USA . 1,420 parts In-Stock

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$23.456

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$21.580

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ChromeModa Solutions

Germany . 3,328 parts In-Stock

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$23.935

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$19.627

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IDEA Electronic Components Group

UK . 1,678 parts In-Stock

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$23.935

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$22.738

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$21.542

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Corohmni

South Africa . 280 parts In-Stock

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$23.967

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$32.744

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$29.797

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$26.850

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Perfect Parts

USA . 147,487 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Infinite Electronics LLP (Excess)

. 2,506 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,000 parts In-Stock

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Futuretech Components

Singapore . 420 parts In-Stock

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Assy Fe

Spain . 395 parts In-Stock

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S.R.D Solutions

India . 265 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.161

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$0.156

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$0.153

100

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$0.153

Overview

Discover the unparalleled quality and reliability of the Texas Instruments SN74HC11DR Logic Gates. With a manufacturer known for excellence in semiconductor technology, this product offers customers exceptional value and performance. Ideal for a wide range of applications, from industrial automation to consumer electronics, this logic gate provides fast propagation delay and low power consumption. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Propagation Delay At Nominal Supply: 25 ns

With a low propagation delay, this product offers fast response times for efficient circuit operation.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage makes it compatible with many existing systems and easy to integrate.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliability in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Logic Gates SN74HC11DR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

25 ns

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HC11DR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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