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SN74ALVC7813-20DLR

Texas Instruments

SN74ALVC7813-20DLR by Texas Instruments

SN74ALVC7813-20DLR by Texas Instruments is a FIFO memory with 64x18 organization, operating at 50 MHz with a cycle time of 20 ns. It has a supply voltage of 3.3V and features synchronous operation, making it suitable for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$3.810

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.300

1k+ parts

$2.950

10k+ parts

$2.780

1,000

-

$3.300

$2.950

$2.780

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.810

1k+ parts

-

10k+ parts

-

1,000

-

$3.810

-

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.125

1k+ parts

$3.688

10k+ parts

$3.475

1,000

-

$4.125

$3.688

$3.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,601 parts In-Stock

1+ parts

$3.477

100+ parts

-

1k+ parts

-

10k+ parts

-

4,601

$3.477

-

-

-

Vyrian

USA . 3,114 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,114

-

-

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DigiKey Marketplace

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,346 parts In-Stock

1+ parts

$2.645

100+ parts

-

1k+ parts

$3.135

10k+ parts

-

2,346

$2.645

-

$3.135

-

ChromeModa Solutions

Germany . 4,522 parts In-Stock

1+ parts

$2.972

100+ parts

$2.437

1k+ parts

-

10k+ parts

-

4,522

$2.972

$2.437

-

-

IDEA Electronic Components Group

UK . 206 parts In-Stock

1+ parts

$2.972

100+ parts

-

1k+ parts

$2.675

10k+ parts

-

206

$2.972

-

$2.675

-

Ampacity Inc.

Singapore . 697 parts In-Stock

1+ parts

$3.110

100+ parts

-

1k+ parts

-

10k+ parts

-

697

$3.110

-

-

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Corphita

USA . 448 parts In-Stock

1+ parts

$3.294

100+ parts

-

1k+ parts

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10k+ parts

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448

$3.294

-

-

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Microchip USA

USA . 4,281 parts In-Stock

1+ parts

-

100+ parts

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4,281

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DigiPath Technology Company

USA . 166 parts In-Stock

1+ parts

-

100+ parts

$2.680

1k+ parts

-

10k+ parts

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166

-

$2.680

-

-

Overview

Upgrade your system with the Texas Instruments SN74ALVC7813-20DLR FIFO memory IC. Designed with precision and reliability in mind, this small outline, shrink pitch package offers a synchronous operating mode with a 20 ns cycle time for seamless performance. Ideal for applications requiring fast data transfer and storage, this FIFO memory IC boasts a 64x18 organization and a 50 MHz maximum clock frequency. Trust in Texas Instruments to deliver cutting-edge technology that enhances the efficiency and functionality of your devices. Elevate your designs with the unmatched quality and value of the SN74ALVC7813-20DLR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and reliable for long-term use.

Cycle Time: 20 ns

Fast cycle time of 20 ns ensures quick processing and retrieval of data.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, making it compatible with various systems.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures consistent and reliable data transfer.

Maximum Clock Frequency (fCLK): 50 MHz

High maximum clock frequency allows for efficient data processing.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Memory Density: 1152 bit

High memory density allows for storing a large amount of data.

Output Enable: YES

Output enable feature provides control over data output, enhancing flexibility.

Maximum Access Time: 13 ns

Low access time ensures quick access to stored data.

Technical Specifications

FIFO SN74ALVC7813-20DLR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

13 ns

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

Memory Density:

1152 bit

Memory IC Type:

Memory Width:

18

No. of Functions:

1

No. of Terminals:

56

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74ALVC7813-20DLR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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