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SN74ALVC7804-40DL

Texas Instruments

SN74ALVC7804-40DL by Texas Instruments

SN74ALVC7804-40DL by Texas Instruments is a FIFO with 512x18 organization, operating at 3.3V. It features a cycle time of 40ns, synchronous operation mode, and max clock frequency of 25MHz. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.

Median Price

$14.030

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 139 parts In-Stock

1+ parts

$14.030

100+ parts

$12.016

1k+ parts

$11.329

10k+ parts

-

139

$14.030

$12.016

$11.329

-

Mouser Electronics

USA . 95 parts In-Stock

1+ parts

$14.030

100+ parts

$10.870

1k+ parts

$10.700

10k+ parts

-

95

$14.030

$10.870

$10.700

-

Chip1Stop

Japan . 120 parts In-Stock

1+ parts

-

100+ parts

$5.532

1k+ parts

-

10k+ parts

-

120

-

$5.532

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.679

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$2.679

-

-

-

Digiode

USA . 245 parts In-Stock

1+ parts

$8.493

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$8.493

-

-

-

Vyrian

USA . 9,836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,836

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 242 parts In-Stock

1+ parts

$4.936

100+ parts

-

1k+ parts

$5.472

10k+ parts

-

242

$4.936

-

$5.472

-

DigiPath Technology Company

USA . 943 parts In-Stock

1+ parts

$5.435

100+ parts

-

1k+ parts

-

10k+ parts

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943

$5.435

-

-

-

IDEA Electronic Components Group

UK . 689 parts In-Stock

1+ parts

$5.546

100+ parts

-

1k+ parts

$4.991

10k+ parts

-

689

$5.546

-

$4.991

-

ChromeModa Solutions

Germany . 83 parts In-Stock

1+ parts

$5.546

100+ parts

$4.548

1k+ parts

-

10k+ parts

-

83

$5.546

$4.548

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$6.629

100+ parts

$6.032

1k+ parts

$5.436

10k+ parts

-

200

$6.629

$6.032

$5.436

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Corphita

USA . 2,022 parts In-Stock

1+ parts

$8.046

100+ parts

-

1k+ parts

-

10k+ parts

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2,022

$8.046

-

-

-

Microchip USA

USA . 1,436 parts In-Stock

1+ parts

$24.300

100+ parts

$23.960

1k+ parts

$23.780

10k+ parts

$23.610

1,436

$24.300

$23.960

$23.780

$23.610

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

-

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Perfect Parts

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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100

-

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-

-

Overview

Elevate your system performance with the SN74ALVC7804-40DL by Texas Instruments, a high-quality FIFO memory IC designed to meet the demands of today's technology. With a focus on reliability and precision, Texas Instruments ensures that this product delivers seamless operation and enhanced efficiency for your applications. Whether you're in the industrial, automotive, or consumer electronics sector, this FIFO memory IC offers unmatched value, benefits, and advantages to optimize your processes and drive innovation. Upgrade to Texas Instruments for cutting-edge solutions that elevate your performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making this product suitable for various environments and conditions.

Cycle Time: 40 ns

Fast cycle time of 40 ns ensures efficient data processing and quick response times.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination in data transfers, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 3.3

Stable supply voltage of 3.3V ensures consistent power delivery to the product, preventing fluctuations that could impact data integrity.

Maximum Clock Frequency (fCLK): 25 MHz

High clock frequency of 25 MHz enables rapid data processing and efficient operation of the FIFO product.

Technology: CMOS

CMOS technology offers low power consumption and compatibility with a wide range of devices, making this FIFO product energy-efficient and versatile.

Technical Specifications

FIFO SN74ALVC7804-40DL attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

24 ns

Maximum Clock Frequency (fCLK):

25 MHz

Cycle Time:

40 ns

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

56

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FIFOs

Maximum Supply Current:

.5 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3.3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74ALVC7804-40DL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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