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SN74ALVC7803-20DLR

Texas Instruments

SN74ALVC7803-20DLR by Texas Instruments

SN74ALVC7803-20DLR by Texas Instruments is a FIFO memory with 512x18 organization, operating at 20ns cycle time and 50MHz clock frequency. It is suitable for applications requiring fast synchronous data transfer in commercial temperature environments.

Median Price

$7.590

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 978 parts In-Stock

1+ parts

-

100+ parts

$6.570

1k+ parts

$5.880

10k+ parts

$5.540

978

-

$6.570

$5.880

$5.540

DigiKey

USA . 978 parts In-Stock

1+ parts

-

100+ parts

$7.590

1k+ parts

-

10k+ parts

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978

-

$7.590

-

-

Verical

USA . 978 parts In-Stock

1+ parts

-

100+ parts

$8.213

1k+ parts

$7.350

10k+ parts

$6.925

978

-

$8.213

$7.350

$6.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,192 parts In-Stock

1+ parts

$6.935

100+ parts

-

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3,192

$6.935

-

-

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Vyrian

USA . 6,301 parts In-Stock

1+ parts

-

100+ parts

-

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6,301

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DigiKey Marketplace

USA . 978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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978

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Speed Components Ltd

Israel . 165 parts In-Stock

1+ parts

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165

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 890 parts In-Stock

1+ parts

$4.697

100+ parts

-

1k+ parts

$5.183

10k+ parts

-

890

$4.697

-

$5.183

-

DigiPath Technology Company

USA . 459 parts In-Stock

1+ parts

$5.172

100+ parts

$4.759

1k+ parts

-

10k+ parts

-

459

$5.172

$4.759

-

-

ChromeModa Solutions

Germany . 4,116 parts In-Stock

1+ parts

$5.278

100+ parts

$4.328

1k+ parts

-

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4,116

$5.278

$4.328

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IDEA Electronic Components Group

UK . 1,534 parts In-Stock

1+ parts

$5.278

100+ parts

-

1k+ parts

$4.750

10k+ parts

-

1,534

$5.278

-

$4.750

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Ampacity Inc.

Singapore . 897 parts In-Stock

1+ parts

$6.210

100+ parts

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897

$6.210

-

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Corphita

USA . 3,822 parts In-Stock

1+ parts

$6.570

100+ parts

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3,822

$6.570

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Component Stockers USA

USA . 708 parts In-Stock

1+ parts

$7.380

100+ parts

$6.940

1k+ parts

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10k+ parts

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708

$7.380

$6.940

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Microchip USA

USA . 195 parts In-Stock

1+ parts

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195

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Overview

Elevate your electronics with the high-quality SN74ALVC7803-20DLR FIFO by Texas Instruments. Designed for optimal performance and reliability, this FIFO device offers seamless data transfer in a compact package. Whether you're working on consumer electronics or industrial automation, this product's synchronous operation and 512x18 organization ensure efficient data handling. Trust Texas Instruments to deliver cutting-edge solutions that enhance your projects and streamline your workflow. Experience the value and benefits of superior technology with the SN74ALVC7803-20DLR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the FIFO, ensuring longevity and reliability.

Cycle Time: 20 ns

The fast cycle time of 20 ns ensures quick and efficient data processing, making this FIFO suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage ensures compatibility with a wide range of electronic systems, making this FIFO versatile and easy to integrate.

Maximum Clock Frequency (fCLK): 50 MHz

With a high maximum clock frequency of 50 MHz, this FIFO can handle rapid data transfer and processing effectively, ideal for time-critical operations.

Memory Density: 9216 bit

The high memory density of 9216 bits allows this FIFO to store a large amount of data, making it suitable for applications that require extensive data buffering.

Technical Specifications

FIFO SN74ALVC7803-20DLR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

13 ns

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

18

No. of Functions:

1

No. of Terminals:

56

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3.3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74ALVC7803-20DLR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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