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SN74ALVC3651-20PQ

Texas Instruments

SN74ALVC3651-20PQ by Texas Instruments

SN74ALVC3651-20PQ by Texas Instruments is a 2Kx36 CMOS FIFO memory with 20ns cycle time and 3.3V nominal voltage. It features synchronous operation, parallel interface, and output enable function. Ideal for applications requiring high-speed data buffering in commercial temperature environments.

Median Price

$15.860

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 828 parts In-Stock

1+ parts

-

100+ parts

$15.860

1k+ parts

-

10k+ parts

-

828

-

$15.860

-

-

Verical

USA . 828 parts In-Stock

1+ parts

-

100+ parts

$18.012

1k+ parts

-

10k+ parts

-

828

-

$18.012

-

-

Rochester

USA . 813 parts In-Stock

1+ parts

-

100+ parts

$13.730

1k+ parts

$12.280

10k+ parts

$11.560

813

-

$13.730

$12.280

$11.560

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,736 parts In-Stock

1+ parts

$14.488

100+ parts

-

1k+ parts

-

10k+ parts

-

2,736

$14.488

-

-

-

Vyrian

USA . 1,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,967

-

-

-

-

DigiKey Marketplace

USA . 828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

828

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,608 parts In-Stock

1+ parts

$2.383

100+ parts

-

1k+ parts

$2.881

10k+ parts

-

1,608

$2.383

-

$2.881

-

DigiPath Technology Company

USA . 731 parts In-Stock

1+ parts

$2.624

100+ parts

$2.414

1k+ parts

-

10k+ parts

-

731

$2.624

$2.414

-

-

ChromeModa Solutions

Germany . 4,147 parts In-Stock

1+ parts

$2.678

100+ parts

$2.196

1k+ parts

-

10k+ parts

-

4,147

$2.678

$2.196

-

-

IDEA Electronic Components Group

UK . 1,555 parts In-Stock

1+ parts

$2.678

100+ parts

-

1k+ parts

$2.410

10k+ parts

-

1,555

$2.678

-

$2.410

-

Ampacity Inc.

Singapore . 615 parts In-Stock

1+ parts

$12.960

100+ parts

-

1k+ parts

-

10k+ parts

-

615

$12.960

-

-

-

Corphita

USA . 4,795 parts In-Stock

1+ parts

$13.725

100+ parts

-

1k+ parts

-

10k+ parts

-

4,795

$13.725

-

-

-

Microchip USA

USA . 375 parts In-Stock

1+ parts

$44.410

100+ parts

$43.770

1k+ parts

$43.460

10k+ parts

$43.140

375

$44.410

$43.770

$43.460

$43.140

Overview

Experience seamless data transfer with the Texas Instruments SN74ALVC3651-20PQ BI-DIRECTIONAL FIFO. Crafted with precision and reliability in mind, this versatile memory IC offers a wide range of applications in various industries. From enhancing system performance to simplifying data management, this FIFO ensures smooth operations with its innovative technology and superior quality. Trust Texas Instruments for exceptional products that deliver value and efficiency to meet your business needs. Elevate your projects with the SN74ALVC3651-20PQ and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring the longevity of the product.

Cycle Time: 20 ns

The fast cycle time of 20 ns allows for quick data access and processing, making this FIFO product suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise and coordinated data transfer, enhancing the overall efficiency of the product.

Memory IC Type: BI-DIRECTIONAL FIFO

The bi-directional FIFO memory IC type allows for simultaneous read and write operations, improving data handling capabilities.

Maximum Access Time: 11.5 ns

The low maximum access time of 11.5 ns contributes to the overall speed and responsiveness of the product, making it ideal for time-sensitive applications.

Technical Specifications

FIFO SN74ALVC3651-20PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

11.5 ns

Additional Features:

RETRANSMIT; MAILBOX

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

132

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

PQFP132(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Trade Compliance

SN74ALVC3651-20PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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