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SN74ALS2233AN

Texas Instruments

SN74ALS2233AN by Texas Instruments

SN74ALS2233AN by Texas Instruments is a 64x9 FIFO with 25ns cycle time and 5V nominal voltage. It operates in synchronous mode, has 3-STATE output characteristics, and supports parallel communication. This memory IC is ideal for applications requiring fast data transfer and reliable storage in commercial temperature environments.

Median Price

$6.250

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 749 parts In-Stock

1+ parts

-

100+ parts

$5.000

1k+ parts

$4.470

10k+ parts

$4.210

749

-

$5.000

$4.470

$4.210

DigiKey

USA . 749 parts In-Stock

1+ parts

-

100+ parts

$6.570

1k+ parts

-

10k+ parts

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749

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$6.570

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-

Verical

USA . 749 parts In-Stock

1+ parts

-

100+ parts

$6.250

1k+ parts

$5.588

10k+ parts

$5.263

749

-

$6.250

$5.588

$5.263

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 595 parts In-Stock

1+ parts

$5.282

100+ parts

-

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595

$5.282

-

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American Microsemiconductor Inc.

USA . 6 parts In-Stock

1+ parts

$6.450

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-

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6

$6.450

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Vyrian

USA . 4,436 parts In-Stock

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4,436

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Bristol Electronics

USA . 101 parts In-Stock

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101

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Inland Empire Components Inc.

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Parana Technologies

USA . 252 parts In-Stock

1+ parts

$3.573

100+ parts

-

1k+ parts

$4.096

10k+ parts

-

252

$3.573

-

$4.096

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ChromeModa Solutions

Germany . 3,650 parts In-Stock

1+ parts

$4.015

100+ parts

$3.292

1k+ parts

-

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3,650

$4.015

$3.292

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IDEA Electronic Components Group

UK . 1,039 parts In-Stock

1+ parts

$4.015

100+ parts

-

1k+ parts

$3.614

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1,039

$4.015

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$3.614

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Corphita

USA . 3,108 parts In-Stock

1+ parts

$5.004

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3,108

$5.004

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DigiPath Technology Company

USA . 1,156 parts In-Stock

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$3.620

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1,156

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$3.620

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Perfect Parts

USA . 113 parts In-Stock

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Assy Fe

Spain . 4 parts In-Stock

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Overview

Unlock seamless data transfer and efficient storage solutions with the SN74ALS2233AN FIFO by Texas Instruments. Made with high-quality materials, this synchronous operating mode device boasts a fast cycle time of 25 ns and a reliable 64x9 organization. Perfect for applications requiring parallel operation, this 3-STATE output FIFO offers a nominal supply voltage of 5V and a commercial temperature grade. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs for speed, reliability, and performance. Elevate your projects with the SN74ALS2233AN today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product.

Cycle Time: 25 ns

The fast cycle time of 25 ns allows for efficient data transfer and processing.

Nominal Supply Voltage / Vsup (V): 5

The optimal supply voltage of 5V ensures stable and consistent performance of the product.

No. of Terminals: 28

The high number of terminals allows for versatile connectivity options.

Maximum Seated Height: 5.08 mm

The compact maximum seated height makes this product suitable for space-constrained applications.

Memory Width: 9

The memory width of 9 allows for efficient storage and retrieval of data.

Technology: TTL

The use of TTL technology ensures compatibility with a wide range of systems and devices.

Parallel or Serial: PARALLEL

The parallel operation allows for faster data transfers compared to serial communication.

No. of Words: 64 words

The high number of words enables the storage of a large amount of data in the FIFO.

Maximum Access Time: 24 ns

The low maximum access time ensures quick access to the stored data.

Technical Specifications

FIFO SN74ALS2233AN attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

24 ns

Cycle Time:

25 ns

JESD-30 Code:

R-PDIP-T28

Length:

36.32 mm

Memory Density:

576 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FIFOs

Maximum Supply Current:

290 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

SN74ALS2233AN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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