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IDT72V243L6BCG

Integrated Device Technology

IDT72V243L6BCG by Integrated Device Technology

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 3.3;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 867 parts In-Stock

1+ parts

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867

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Nova Conductors

Japan . 66 parts In-Stock

1+ parts

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66

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,325 parts In-Stock

1+ parts

$6.000

100+ parts

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1,325

$6.000

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AZTECH Wire

Italy . 517 parts In-Stock

1+ parts

$12.904

100+ parts

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517

$12.904

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Continental Prestige Electronics

USA . 2,628 parts In-Stock

1+ parts

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2,628

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Argo Parts USA

USA . 1,083 parts In-Stock

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1,083

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Technical Specifications

FIFO IDT72V243L6BCG attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

4 ns

Additional Features:

IT CAN ALSO BE CONFIGURED AS 4K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE

Alternate Memory Width:

9

Maximum Clock Frequency (fCLK):

166 MHz

Cycle Time:

6 ns

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

11 mm

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA100,10X10,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Maximum Standby Current:

.015 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11 mm

Trade Compliance

IDT72V243L6BCG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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