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SN74ACT7881-20PN

Texas Instruments

SN74ACT7881-20PN by Texas Instruments

SN74ACT7881-20PN by Texas Instruments is a FIFO with 1KX18 organization, 20 ns cycle time, and 50 MHz clock frequency. It operates synchronously at 5V and has a memory density of 18432 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$16.905

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 72 parts In-Stock

1+ parts

-

100+ parts

$15.680

1k+ parts

$14.030

10k+ parts

$13.210

72

-

$15.680

$14.030

$13.210

DigiKey

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$18.130

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48

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$18.130

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,416 parts In-Stock

1+ parts

$16.558

100+ parts

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1,416

$16.558

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Semi Source

USA . 9,712 parts In-Stock

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9,712

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Vyrian

USA . 7,306 parts In-Stock

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DigiKey Marketplace

USA . 307 parts In-Stock

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307

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Semtec, LLC

USA . 23 parts In-Stock

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23

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$4.246

100+ parts

$3.864

1k+ parts

$3.482

10k+ parts

-

550

$4.246

$3.864

$3.482

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Parana Technologies

USA . 1,416 parts In-Stock

1+ parts

$4.894

100+ parts

-

1k+ parts

$5.426

10k+ parts

-

1,416

$4.894

-

$5.426

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DigiPath Technology Company

USA . 1,059 parts In-Stock

1+ parts

$5.389

100+ parts

$4.958

1k+ parts

-

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1,059

$5.389

$4.958

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ChromeModa Solutions

Germany . 6,038 parts In-Stock

1+ parts

$5.499

100+ parts

$4.509

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-

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6,038

$5.499

$4.509

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IDEA Electronic Components Group

UK . 873 parts In-Stock

1+ parts

$5.499

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$4.949

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873

$5.499

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$4.949

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Corphita

USA . 487 parts In-Stock

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$15.687

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487

$15.687

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Microchip USA

USA . 409 parts In-Stock

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409

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Overview

Experience seamless and efficient data transfer with the SN74ACT7881-20PN FIFO by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliability and performance in every component. This FIFO device is perfect for a wide range of applications, offering customers a valuable solution for managing data with ease. Trust in the advantages of this product to streamline your processes and enhance your systems for optimal functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Cycle Time: 20 ns

The fast cycle time of 20 ns ensures quick data access and transfer, making it suitable for high-speed data processing requirements.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise timing and coordination, making it suitable for applications that require strict synchronization.

Maximum Clock Frequency (fCLK): 50 MHz

With a high maximum clock frequency of 50 MHz, the product can handle high-speed data processing tasks efficiently.

Memory Width: 18

The wide memory width of 18 bits allows for storing and retrieving large chunks of data at once, improving overall efficiency.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, making it suitable for battery-powered devices.

No. of Words: 1024 words

The large number of words that can be stored in the FIFO memory increases the storage capacity, making it suitable for applications with large data requirements.

Technical Specifications

FIFO SN74ACT7881-20PN attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

13 ns

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

SN74ACT7881-20PN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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