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SN74ACT7813-20DLR

Texas Instruments

SN74ACT7813-20DLR by Texas Instruments

SN74ACT7813-20DLR by Texas Instruments is a FIFO memory with 64x18 organization, 20ns cycle time, and 50MHz clock frequency. It operates synchronously at 5V and has a small outline package for surface mounting. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$7.610

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$6.580

1k+ parts

$5.890

10k+ parts

$5.540

1,000

-

$6.580

$5.890

$5.540

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$7.610

1k+ parts

-

10k+ parts

-

1,000

-

$7.610

-

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$8.225

1k+ parts

$7.362

10k+ parts

$6.925

1,000

-

$8.225

$7.362

$6.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,543 parts In-Stock

1+ parts

$6.954

100+ parts

-

1k+ parts

-

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3,543

$6.954

-

-

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Vyrian

USA . 6,554 parts In-Stock

1+ parts

-

100+ parts

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6,554

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DigiKey Marketplace

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

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1,000

-

-

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Legend Electronics Inc.

USA . 100 parts In-Stock

1+ parts

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1k+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 872 parts In-Stock

1+ parts

$4.283

100+ parts

-

1k+ parts

$4.712

10k+ parts

-

872

$4.283

-

$4.712

-

ChromeModa Solutions

Germany . 4,285 parts In-Stock

1+ parts

$4.812

100+ parts

$3.946

1k+ parts

-

10k+ parts

-

4,285

$4.812

$3.946

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IDEA Electronic Components Group

UK . 473 parts In-Stock

1+ parts

$4.812

100+ parts

-

1k+ parts

$4.331

10k+ parts

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473

$4.812

-

$4.331

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Ampacity Inc.

Singapore . 511 parts In-Stock

1+ parts

$6.220

100+ parts

-

1k+ parts

-

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511

$6.220

-

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Corphita

USA . 1,132 parts In-Stock

1+ parts

$6.588

100+ parts

-

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10k+ parts

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1,132

$6.588

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Component Stockers USA

USA . 2,208 parts In-Stock

1+ parts

$7.570

100+ parts

$7.120

1k+ parts

$6.440

10k+ parts

-

2,208

$7.570

$7.120

$6.440

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DigiPath Technology Company

USA . 1,380 parts In-Stock

1+ parts

-

100+ parts

$4.338

1k+ parts

-

10k+ parts

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1,380

-

$4.338

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Microchip USA

USA . 166 parts In-Stock

1+ parts

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166

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Overview

Unlock the power of seamless data transfer with the Texas Instruments SN74ACT7813-20DLR FIFO. With a reputation for excellence in manufacturing, Texas Instruments delivers top-notch quality and reliability. This FIFO device is perfect for a wide range of applications, offering customers value, efficiency, and superior performance. Streamline your processes and enhance productivity with the SN74ACT7813-20DLR FIFO from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for electronic components

Cycle Time: 20 ns

Fast operation speed, ensures efficient data handling

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfer, reducing errors

Nominal Supply Voltage / Vsup (V): 5

Standard voltage for compatibility with various systems

Maximum Clock Frequency (fCLK): 50 MHz

High clock frequency for rapid data processing

Technical Specifications

FIFO SN74ACT7813-20DLR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

13 ns

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

Memory Density:

1152 bit

Memory IC Type:

Memory Width:

18

No. of Functions:

1

No. of Terminals:

56

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74ACT7813-20DLR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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