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SN74ACT7808-25FN

Texas Instruments

SN74ACT7808-25FN by Texas Instruments

SN74ACT7808-25FN by Texas Instruments is a FIFO chip with 2Kx9 organization, 25ns cycle time, and 40MHz clock frequency. Ideal for synchronous operations in applications requiring fast data transfer and storage. Operating at 5V with 44 terminals, it offers high-speed performance in a compact square chip carrier package.

Median Price

$14.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 165 parts In-Stock

1+ parts

-

100+ parts

$14.270

1k+ parts

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165

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$14.270

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Rochester

USA . 87 parts In-Stock

1+ parts

-

100+ parts

$12.350

1k+ parts

$11.050

10k+ parts

$10.400

87

-

$12.350

$11.050

$10.400

Verical

USA . 78 parts In-Stock

1+ parts

-

100+ parts

$15.438

1k+ parts

$13.813

10k+ parts

$13.000

78

-

$15.438

$13.813

$13.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,219 parts In-Stock

1+ parts

$13.034

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-

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1,219

$13.034

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Vyrian

USA . 7,404 parts In-Stock

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7,404

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DigiKey Marketplace

USA . 165 parts In-Stock

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165

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,246 parts In-Stock

1+ parts

$3.995

100+ parts

-

1k+ parts

$4.463

10k+ parts

-

1,246

$3.995

-

$4.463

-

ChromeModa Solutions

Germany . 6,202 parts In-Stock

1+ parts

$4.489

100+ parts

$3.681

1k+ parts

-

10k+ parts

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6,202

$4.489

$3.681

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IDEA Electronic Components Group

UK . 433 parts In-Stock

1+ parts

$4.489

100+ parts

-

1k+ parts

$4.040

10k+ parts

-

433

$4.489

-

$4.040

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Corphita

USA . 2,254 parts In-Stock

1+ parts

$12.348

100+ parts

-

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2,254

$12.348

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QUARKTWIN TECHNOLOGY LTD

USA . 16,298 parts In-Stock

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Microchip USA

USA . 2,920 parts In-Stock

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2,920

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DigiPath Technology Company

USA . 1,945 parts In-Stock

1+ parts

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100+ parts

$4.047

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1,945

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$4.047

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Assy Fe

Spain . 2 parts In-Stock

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2

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Overview

Enhance your electronic designs with the SN74ACT7808-25FN by Texas Instruments, a top-of-the-line FIFO chip that guarantees reliability and performance. With a 25 ns cycle time and a synchronous operating mode, this chip is perfect for a wide range of applications. Trust in Texas Instruments' reputation for quality and innovation as you enjoy the benefits of faster data processing, smoother operation, and seamless integration. Upgrade your projects today with the SN74ACT7808-25FN and experience the difference in efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the FIFO, ensuring a longer lifespan.

Cycle Time: 25 ns

Fast cycle time of 25 ns allows for quick data transfer and efficient operation of the FIFO.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transferred in a controlled and coordinated manner, reducing the likelihood of errors.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40 MHz enables fast data processing and communication within the FIFO.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FIFO energy-efficient and reliable.

Technical Specifications

FIFO SN74ACT7808-25FN attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

22 ns

Maximum Clock Frequency (fCLK):

40 MHz

Cycle Time:

25 ns

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e4

Length:

16.585 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

SN74ACT7808-25FN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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