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SN74ACT3622-30PCB

Texas Instruments

SN74ACT3622-30PCB by Texas Instruments

Texas Instruments SN74ACT3622-30PCB FIFO operates synchronously at 5V with a cycle time of 30ns. Featuring 256x36 organization, it supports a max clock frequency of 33.4MHz. Ideal for applications requiring high-speed data buffering and retrieval in commercial-grade environments.

Median Price

$14.240

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 286 parts In-Stock

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-

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$14.240

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Rochester

USA . 271 parts In-Stock

1+ parts

-

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$12.320

1k+ parts

$11.020

10k+ parts

$10.380

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$12.320

$11.020

$10.380

Verical

USA . 271 parts In-Stock

1+ parts

-

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$15.400

1k+ parts

$13.775

10k+ parts

$12.975

271

-

$15.400

$13.775

$12.975

Distributors (In-Stock)

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Digiode

USA . 4,598 parts In-Stock

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$13.006

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4,598

$13.006

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Vyrian

USA . 3,994 parts In-Stock

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3,994

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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Bristol Electronics

USA . 90 parts In-Stock

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Dan-Mar Components

USA . 90 parts In-Stock

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90

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Distributors (Availability)

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Parana Technologies

USA . 846 parts In-Stock

1+ parts

$3.539

100+ parts

-

1k+ parts

$4.061

10k+ parts

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846

$3.539

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$4.061

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$3.803

100+ parts

$3.765

1k+ parts

$3.613

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500

$3.803

$3.765

$3.613

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ChromeModa Solutions

Germany . 4,287 parts In-Stock

1+ parts

$3.976

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$3.260

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4,287

$3.976

$3.260

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IDEA Electronic Components Group

UK . 136 parts In-Stock

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$3.976

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$3.578

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136

$3.976

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$3.578

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Corphita

USA . 125 parts In-Stock

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$12.321

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$12.321

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DigiPath Technology Company

USA . 1,594 parts In-Stock

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$3.585

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1,594

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$3.585

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Microchip USA

USA . 401 parts In-Stock

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Perfect Parts

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Overview

Unlock seamless data transfer and storage with the Texas Instruments SN74ACT3622-30PCB FIFO memory IC. Designed for reliability, this high-quality product offers a fast cycle time of 30ns and operates at a nominal supply voltage of 5V. Perfect for a wide range of applications, this bi-directional FIFO memory ensures efficient parallel data transfer at a clock frequency of up to 33.4MHz. Trust Texas Instruments for cutting-edge technology that delivers unmatched performance and value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Cycle Time: 30 ns

With a fast cycle time of 30 ns, this FIFO device can efficiently process data and manage input/output operations at high speeds.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard electronic systems and power sources.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise timing and synchronization, making it suitable for real-time data processing and communication applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the device to function reliably in various environmental conditions without overheating.

Memory IC Type: BI-DIRECTIONAL FIFO

The bidirectional FIFO memory IC type enables efficient data transfer in both directions, providing flexibility in interfacing with different systems and devices.

Technical Specifications

FIFO SN74ACT3622-30PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

MAILBOX

Maximum Clock Frequency (fCLK):

33.4 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G120

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

120

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74ACT3622-30PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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