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SN54H78W

Texas Instruments

SN54H78W by Texas Instruments

The Texas Instruments SN54H78W is a TTL technology latches & flip-flops IC with 2 functions, operating b/w -55°C to 125°C. It features a master-slave trigger type and comes in a ceramic flatpack package style suitable for military-grade applications. The IC has 14 terminals on a rectangular body, making it ideal for surface mount installations.

Median Price

$65.350

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 119 parts In-Stock

1+ parts

$65.350

100+ parts

$61.430

1k+ parts

$57.510

10k+ parts

-

119

$65.350

$61.430

$57.510

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DigiKey

USA . 119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

119

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey Marketplace

USA . 119 parts In-Stock

1+ parts

$65.030

100+ parts

-

1k+ parts

-

10k+ parts

-

119

$65.030

-

-

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Digiode

USA . 2,958 parts In-Stock

1+ parts

$65.692

100+ parts

-

1k+ parts

-

10k+ parts

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2,958

$65.692

-

-

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Vyrian

USA . 4,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,697 parts In-Stock

1+ parts

$17.675

100+ parts

-

1k+ parts

$17.864

10k+ parts

-

1,697

$17.675

-

$17.864

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ChromeModa Solutions

Germany . 4,748 parts In-Stock

1+ parts

$19.860

100+ parts

$16.285

1k+ parts

-

10k+ parts

-

4,748

$19.860

$16.285

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-

IDEA Electronic Components Group

UK . 2,279 parts In-Stock

1+ parts

$19.860

100+ parts

$18.867

1k+ parts

$17.874

10k+ parts

-

2,279

$19.860

$18.867

$17.874

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Corphita

USA . 642 parts In-Stock

1+ parts

$62.235

100+ parts

-

1k+ parts

-

10k+ parts

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642

$62.235

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-

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DigiPath Technology Company

USA . 2,168 parts In-Stock

1+ parts

-

100+ parts

$17.906

1k+ parts

-

10k+ parts

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2,168

-

$17.906

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Overview

Discover the cutting-edge SN54H78W by Texas Instruments, a top-tier manufacturer known for delivering high-quality latches & flip-flops. Designed with precision and reliability in mind, this product offers unmatched performance in military-grade applications. With its advanced technology and sturdy ceramic body, this rectangular flatpack packs a punch with 2 functions and dual terminals for maximum efficiency. Trust Texas Instruments to provide a solution that exceeds your expectations every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package body provides excellent heat dissipation, ensuring the stability and reliability of the latch or flip-flop in high temperature environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto PCBs, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having 2 functions in one component increases functionality and versatility, making it a cost-effective solution for circuit design.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts and makes it easier to integrate into existing designs.

No. of Terminals: 14

With a higher number of terminals, this latch or flip-flop can support more connections and features, enhancing its usability in complex circuits.

Package Style (Meter): FLATPACK

The flatpack style provides a compact and low-profile design, ideal for space-constrained applications or when a sleek appearance is desired.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this component can withstand demanding thermal conditions, ensuring reliable performance in various environments.

Trigger Type: MASTER-SLAVE

The master-slave trigger type offers precise control and synchronization of data transfers, making it suitable for applications requiring accurate timing and sequencing.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for reliable operation even in extreme cold environments, ensuring consistent performance in a wide range of conditions.

Terminal Position: DUAL

Dual terminal positions provide flexibility in connectivity options, accommodating different circuit layouts and allowing for easier integration into diverse systems.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure robust performance and durability, making this latch or flip-flop suitable for rugged applications and harsh operating environments.

Technology: TTL

TTL technology offers fast and reliable signal processing, making this component suitable for high-speed data handling and communication applications.

Terminal Form: FLAT

Flat terminal form simplifies soldering and ensures secure connections, enhancing the overall reliability and longevity of the latch or flip-flop.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for dense packing on PCBs, enabling high-performance and miniaturized circuit designs without sacrificing functionality.

Technical Specifications

Latches & Flip-Flops SN54H78W attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F14

Logic IC Type:

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

MASTER-SLAVE

Trade Compliance

SN54H78W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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