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SN54105N

Texas Instruments

SN54105N by Texas Instruments

SN54105N by Texas Instruments is a TTL technology latch with 14 terminals in an in-line package. It operates b/w -55°C to 125°C, making it suitable for military-grade applications. Featuring a master-slave trigger type, this rectangular plastic/epoxy package is ideal for dual-terminal setups.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,806 parts In-Stock

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4,806

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Digiode

USA . 2,466 parts In-Stock

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2,466

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Distributors (Availability)

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AZTECH Wire

Italy . 779 parts In-Stock

1+ parts

$5.531

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779

$5.531

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Parana Technologies

USA . 1,288 parts In-Stock

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$14.914

100+ parts

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$15.339

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1,288

$14.914

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$15.339

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DigiPath Technology Company

USA . 239 parts In-Stock

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$16.422

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239

$16.422

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ChromeModa Solutions

Germany . 6,173 parts In-Stock

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$16.757

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$13.741

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6,173

$16.757

$13.741

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IDEA Electronic Components Group

UK . 2,053 parts In-Stock

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$16.757

100+ parts

$15.919

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$15.081

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2,053

$16.757

$15.919

$15.081

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One Stop Electronics

USA . 1,042 parts In-Stock

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$37.000

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1,042

$37.000

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Corphita

USA . 1,381 parts In-Stock

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1,381

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Overview

Upgrade your electronic projects with the reliable SN54105N latches & flip-flops by Texas Instruments. With a sturdy plastic/epoxy package and military-grade temperature tolerance, this versatile component is perfect for a wide range of applications. From industrial automation to consumer electronics, trust in Texas Instruments for quality engineering and exceptional performance. Experience seamless operation and peace of mind knowing that your circuits are in good hands with the SN54105N. Elevate your designs with this top-notch component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and durability, making the latch reliable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and placement in various electronic devices or circuits.

No. of Terminals: 14

With 14 terminals, this latch offers flexibility in connecting to different components or devices.

Package Style (Meter): IN-LINE

The in-line package style simplifies the integration of the latch into existing systems or circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this latch is suitable for demanding industrial applications.

Trigger Type: MASTER-SLAVE

The master-slave trigger type ensures precise and controlled operation of the latch in various electronic systems.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows the latch to function reliably even in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position offers flexibility in connecting the latch to external devices or circuits, enhancing usability.

Technology: TTL

TTL technology ensures high-speed and reliable digital signal processing, making this latch suitable for applications requiring fast data transfer.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables easy and secure soldering of the latch onto circuit boards, ensuring stable connections.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this latch offers compatibility with standard electronic components and devices, simplifying integration.

Technical Specifications

Latches & Flip-Flops SN54105N attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

Logic IC Type:

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

MASTER-SLAVE

Trade Compliance

SN54105N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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