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SN54105W

Texas Instruments

SN54105W by Texas Instruments

SN54105W by Texas Instruments is a TTL technology latch with 2 bits, 25 ns propagation delay, and 5V nominal voltage. It is used in military-grade applications for positive edge triggering, with a temperature range of -55 to 125°C and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,857 parts In-Stock

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Digiode

USA . 2,865 parts In-Stock

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2,865

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Distributors (Availability)

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AZTECH Wire

Italy . 807 parts In-Stock

1+ parts

$18.996

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807

$18.996

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Parana Technologies

USA . 416 parts In-Stock

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$29.141

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$55.956

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416

$29.141

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$55.956

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DigiPath Technology Company

USA . 566 parts In-Stock

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$32.088

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566

$32.088

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ChromeModa Solutions

Germany . 533 parts In-Stock

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$32.743

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$26.849

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533

$32.743

$26.849

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IDEA Electronic Components Group

UK . 432 parts In-Stock

1+ parts

$32.743

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$31.106

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$29.469

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432

$32.743

$31.106

$29.469

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One Stop Electronics

USA . 378 parts In-Stock

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$39.000

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378

$39.000

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Corphita

USA . 2,823 parts In-Stock

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Overview

Enhance your electronic projects with the SN54105W from Texas Instruments, a leading manufacturer known for top-quality components. Ideal for latches & flip-flops applications, this product offers reliable performance and precision engineering. With a nominal supply voltage of 5V and a fast propagation delay of 25ns, it delivers exceptional value and efficiency. Upgrade your designs with the SN54105W and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it versatile for various applications.

Propagation Delay (tpd): 25 ns

Offers fast response time, enabling quick switching between states.

Trigger Type: POSITIVE EDGE

Provides precise control over the timing of events, ensuring accurate operation.

Temperature Grade: MILITARY

Designed to operate reliably in harsh environments, ideal for military or aerospace applications.

Technology: TTL

Utilizes TTL technology known for its high-speed operation and robustness.

Technical Specifications

Latches & Flip-Flops SN54105W attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

4-IN AND GATED J/K INPUTS

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

28 mA

Propagation Delay (tpd):

25 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.29 mm

Trade Compliance

SN54105W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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