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SN54100W-00

Texas Instruments

SN54100W-00 by Texas Instruments

SN54100W-00 by Texas Instruments is a TTL technology latch with 4 bits, 2 functions, and a propagation delay of 15 ns. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V. Ideal for military-grade applications requiring high-level trigger type latches in a flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,191 parts In-Stock

1+ parts

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7,191

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Digiode

USA . 4,750 parts In-Stock

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4,750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 490 parts In-Stock

1+ parts

$5.159

100+ parts

-

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490

$5.159

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One Stop Electronics

USA . 1,620 parts In-Stock

1+ parts

$14.000

100+ parts

-

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1,620

$14.000

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Parana Technologies

USA . 943 parts In-Stock

1+ parts

$25.272

100+ parts

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$25.906

10k+ parts

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943

$25.272

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$25.906

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DigiPath Technology Company

USA . 1,163 parts In-Stock

1+ parts

$27.828

100+ parts

$25.602

1k+ parts

-

10k+ parts

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1,163

$27.828

$25.602

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ChromeModa Solutions

Germany . 2,446 parts In-Stock

1+ parts

$28.396

100+ parts

$23.285

1k+ parts

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10k+ parts

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2,446

$28.396

$23.285

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IDEA Electronic Components Group

UK . 1,661 parts In-Stock

1+ parts

$28.396

100+ parts

$26.976

1k+ parts

$25.556

10k+ parts

-

1,661

$28.396

$26.976

$25.556

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Corphita

USA . 4,812 parts In-Stock

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4,812

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Overview

Texas Instruments, a leading manufacturer in the industry, presents the SN54100W-00 latches & flip-flops. This high-quality product offers customers reliability and precision in their applications. With a nominal supply voltage of 5V and a propagation delay of 15ns, this component ensures optimal performance. Ideal for military-grade projects, the SN54100W-00 is designed to meet demanding requirements while providing efficient operation. Upgrade your design with Texas Instruments' trusted technology and experience enhanced functionality like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Easy to install and saves space on the PCB.

No. of Functions: 2

Provides multiple functions in a single component, saving board space and simplifying circuit design.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for compatibility with most systems.

Propagation Delay (tpd): 15 ns

Fast response time for efficient operation.

Maximum Operating Temperature: 125 °C

Suitable for use in high-temperature environments.

Technology: TTL

Uses TTL technology known for its reliability and high-speed operation.

Technical Specifications

Latches & Flip-Flops SN54100W-00 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F24

Length:

14.36 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

92 mA

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.29 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

HIGH LEVEL

Width:

9.09 mm

Trade Compliance

SN54100W-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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