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SN54110J

Texas Instruments

SN54110J by Texas Instruments

SN54110J by Texas Instruments is a TTL latch with 2 bits, 20ns propagation delay, and 15pF load capacitance. Ideal for military applications, it operates b/w -55 to 125°C with a supply voltage range of 4.5V to 5.5V.

Median Price

$3.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 2 parts In-Stock

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$3.800

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$3.800

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Vyrian

USA . 6,011 parts In-Stock

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6,011

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Digiode

USA . 4,617 parts In-Stock

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4,617

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ECAB

Sweden . 80 parts In-Stock

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Electronics Depot

USA . 4 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 616 parts In-Stock

1+ parts

$19.580

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616

$19.580

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Parana Technologies

USA . 462 parts In-Stock

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$22.924

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$23.581

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462

$22.924

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$23.581

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ChromeModa Solutions

Germany . 6,879 parts In-Stock

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$25.757

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$21.121

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6,879

$25.757

$21.121

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IDEA Electronic Components Group

UK . 1,448 parts In-Stock

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$25.757

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$24.469

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$23.181

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$25.757

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One Stop Electronics

USA . 1,116 parts In-Stock

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$27.000

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Corphita

USA . 4,404 parts In-Stock

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4,404

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DigiPath Technology Company

USA . 2,234 parts In-Stock

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$23.223

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Enhance your electronic projects with the SN54110J by Texas Instruments, a top-tier manufacturer known for quality and reliability. As a versatile latches & flip-flops component, this product offers seamless integration and exceptional performance in various applications. With a nominal supply voltage of 5V and low propagation delay of 20ns, customers can experience fast and efficient operation. Experience the benefits of a high-quality ceramic, glass-sealed package, military-grade temperature tolerance, and a wide operating range. Upgrade your projects today with the SN54110J for unparalleled value and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection, ensuring long-term reliability.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Propagation Delay (tpd): 20 ns

Fast response time for quick switching operations, suitable for high-speed applications.

Temperature Grade: MILITARY

Designed to operate in harsh environmental conditions, making it suitable for military or industrial applications.

Technology: TTL

Uses TTL technology known for its reliability and robustness, ensuring stable performance.

Technical Specifications

Latches & Flip-Flops SN54110J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

MASTER SLAVE OPERATION WITH LOCKOUT; 3-IN AND GATED J/K INPUTS

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

34 mA

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

NEGATIVE EDGE

Width:

7.62 mm

Minimum fmax:

20 MHz

Trade Compliance

SN54110J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-325-7793, 5962003257793, 5962-14-342-7412, 5962143427412

NIIN

003257793, 143427412

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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