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SN54104J

Texas Instruments

SN54104J by Texas Instruments

SN54104J by Texas Instruments is a TTL technology latch with 2 bits, 14 terminals, and a propagation delay of 25 ns. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,688 parts In-Stock

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Digiode

USA . 2,219 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 4 parts In-Stock

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Electronic Expediters

USA . 4 parts In-Stock

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Prism Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 279 parts In-Stock

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$11.956

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One Stop Electronics

USA . 363 parts In-Stock

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$17.000

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Parana Technologies

USA . 1,312 parts In-Stock

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$28.463

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$47.829

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$47.829

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DigiPath Technology Company

USA . 2,143 parts In-Stock

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$31.341

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ChromeModa Solutions

Germany . 6,770 parts In-Stock

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$31.981

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$26.224

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IDEA Electronic Components Group

UK . 1,368 parts In-Stock

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$31.981

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$30.382

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$28.783

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$28.783

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Corphita

USA . 3,523 parts In-Stock

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Overview

Upgrade your electronic projects with the SN54104J from Texas Instruments! As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality latches & flip-flops for various applications. With a nominal supply voltage of 5V and a propagation delay of just 25ns, this versatile component offers fast and reliable performance. Whether you're working on military-grade equipment or consumer electronics, the SN54104J provides the value, benefits, and advantages you need to take your designs to the next level. Trust Texas Instruments for superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliable performance in various environments.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Propagation Delay (tpd): 25 ns

Fast response time allows for quick signal processing, ideal for applications requiring high-speed operation.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, making it suitable for industrial or military applications.

Technology: TTL

Utilizes Transistor-Transistor Logic technology for reliable and efficient signal processing, ensuring accurate data transmission.

Technical Specifications

Latches & Flip-Flops SN54104J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

4-IN AND GATED J/K INPUTS

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

24 mA

Propagation Delay (tpd):

25 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

SN54104J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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