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74LVX74MTC

Onsemi

74LVX74MTC by Onsemi

74LVX74MTC by Onsemi is a dual-function latches & flip-flops IC with a propagation delay of 15ns and max frequency of 50MHz. It operates at supply voltages b/w 2V to 3.6V, making it ideal for industrial applications requiring fast signal processing in compact designs.

Median Price

$0.172

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 51,700 parts In-Stock

1+ parts

-

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$0.120

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$0.120

Flip Electronics (Authorized)

USA . 51,700 parts In-Stock

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51,700

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Rochester

USA . 37,762 parts In-Stock

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-

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$0.186

1k+ parts

$0.155

10k+ parts

$0.138

37,762

-

$0.186

$0.155

$0.138

Verical

USA . 37,762 parts In-Stock

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$0.172

37,762

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$0.172

Distributors (In-Stock)

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Freelance Electronics

USA . 3 parts In-Stock

1+ parts

$0.077

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3

$0.077

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Digiode

USA . 2,431 parts In-Stock

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$0.181

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2,431

$0.181

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Nova Conductors

Japan . 300 parts In-Stock

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$0.256

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300

$0.256

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Flip Electronics

USA . 51,700 parts In-Stock

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DigiKey Marketplace

USA . 51,700 parts In-Stock

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Vyrian

USA . 29,905 parts In-Stock

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VNN

France . 4,147 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,523 parts In-Stock

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ComSIT USA

USA . 2,523 parts In-Stock

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Anansix

USA . 911 parts In-Stock

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LWI Electronics Inc

India . 291 parts In-Stock

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291

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Bristol Electronics

USA . 198 parts In-Stock

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Electronics Depot

USA . 9 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 230 parts In-Stock

1+ parts

$0.077

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230

$0.077

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Ampacity Inc.

Singapore . 30,254 parts In-Stock

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$0.162

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30,254

$0.162

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Semicontronic

India . 29,932 parts In-Stock

1+ parts

$0.162

100+ parts

$0.158

1k+ parts

$0.157

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-

29,932

$0.162

$0.158

$0.157

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Corphita

USA . 2,462 parts In-Stock

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$0.172

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2,462

$0.172

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Netroflash

USA . 100 parts In-Stock

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$0.256

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$0.251

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100

$0.256

$0.251

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Aztec Data Supply Inc.

USA . 4,920 parts In-Stock

1+ parts

$25.378

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$25.378

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Continental Prestige Electronics

USA . 36,686 parts In-Stock

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$0.159

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36,686

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Perfect Parts

USA . 10,227 parts In-Stock

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SupplyDigital Components

Austria . 6,638 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,403 parts In-Stock

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Kepictronics

USA . 4,700 parts In-Stock

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RC Electronics

USA . 4,500 parts In-Stock

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$0.040

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$0.030

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$0.040

$0.030

$0.030

Problanco Electronics

Mexico . 4,379 parts In-Stock

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Microchip USA

USA . 4,326 parts In-Stock

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TANS Electronics

Latvia . 3,021 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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Kulean Microsystems

USA . 1,734 parts In-Stock

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Argo Parts USA

USA . 1,614 parts In-Stock

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Assy Fe

Spain . 1,401 parts In-Stock

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UHIMA Technologies

Türkiye . 648 parts In-Stock

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648

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Supply Digital

USA . 608 parts In-Stock

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608

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Overview

Unleash the power of innovation with the 74LVX74MTC by Onsemi, a cutting-edge latches & flip-flops component designed for high-performance applications. With Onsemi's reputation for quality and reliability, this product offers customers unmatched value and benefits. Experience lightning-fast propagation delays, a wide operating temperature range, and versatile surface mount capabilities. Ideal for industrial-grade projects, this component guarantees seamless functionality and durability. Elevate your designs with the 74LVX74MTC and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this latch & flip-flop lightweight and durable, ideal for portable electronic devices.

Propagation Delay At Nominal Supply: 15 ns

With a fast propagation delay of 15 ns, this product ensures quick response times, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable, this latch & flip-flop is easy to integrate into compact circuit designs, saving space and offering convenience during assembly.

No. of Functions: 2

With two functions in one device, this product offers versatility and efficiency in handling multiple tasks within the circuit.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard form factor that is compatible with various PCB layouts, ensuring easy integration into different electronic systems.

Technical Specifications

Latches & Flip-Flops 74LVX74MTC attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

50000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

80 MHz

Trade Compliance

74LVX74MTC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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