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SN54110J-00

Texas Instruments

SN54110J-00 by Texas Instruments

SN54110J-00 by Texas Instruments is a 2-bit latch with 20ns propagation delay. Operating at -55 to 125°C, it has a supply voltage range of 4.5V to 5.5V and load capacitance of 15pF. Ideal for military-grade applications requiring TTL technology and negative edge triggering in a ceramic package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,369 parts In-Stock

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4,369

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Vyrian

USA . 2,428 parts In-Stock

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2,428

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Distributors (Availability)

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Parana Technologies

USA . 18 parts In-Stock

1+ parts

$11.123

100+ parts

-

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$11.577

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18

$11.123

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$11.577

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DigiPath Technology Company

USA . 1,587 parts In-Stock

1+ parts

$12.248

100+ parts

$11.268

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1,587

$12.248

$11.268

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ChromeModa Solutions

Germany . 1,413 parts In-Stock

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$12.498

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$10.248

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1,413

$12.498

$10.248

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IDEA Electronic Components Group

UK . 456 parts In-Stock

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$12.498

100+ parts

$11.873

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$11.248

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456

$12.498

$11.873

$11.248

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AZTECH Wire

Italy . 612 parts In-Stock

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$14.560

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612

$14.560

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One Stop Electronics

USA . 662 parts In-Stock

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$17.000

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662

$17.000

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Corphita

USA . 659 parts In-Stock

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659

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Overview

Discover the cutting-edge SN54110J-00 by Texas Instruments, a top-quality latches & flip-flops product that offers unparalleled reliability and performance. Ideal for military-grade applications, this ceramic, glass-sealed rectangular package boasts a fast propagation delay of 20 ns and a wide temperature range. With a nominal supply voltage of 5V and 14 terminals, this versatile component guarantees seamless operation. Trust Texas Instruments to deliver innovative solutions that exceed expectations, providing you with the edge you need in your projects. Elevate your designs with the SN54110J-00!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body ensures durability and reliability in various environmental conditions, making this latch & flip-flop a good choice for robust applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes integration with other components easier and ensures compatibility with standard electronic systems.

Propagation Delay (tpd): 20 ns

The fast propagation delay of 20 ns allows for quick switching operations, making this latch & flip-flop suitable for high-speed applications.

Temperature Grade: MILITARY

Designed to withstand extreme temperature ranges, the military-grade temperature rating ensures reliable operation in harsh environments, making it a preferred choice for critical applications.

Technology: TTL

Utilizing TTL technology provides compatibility with a wide range of devices and ensures reliable logic operation, making this latch & flip-flop a versatile choice for different electronic systems.

Technical Specifications

Latches & Flip-Flops SN54110J-00 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

MASTER SLAVE OPERATION WITH LOCKOUT

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

34 mA

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

7.62 mm

Minimum fmax:

20 MHz

Trade Compliance

SN54110J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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