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MC74ACT259DG

Onsemi

MC74ACT259DG by Onsemi

MC74ACT259DG by Onsemi is a CMOS latch with 12.5 ns propagation delay at 5V, suitable for industrial applications. It features 16 terminals in a small outline package with matte tin finish and operates b/w -40 to 85 °C. The flip-flop has a load capacitance of 50 pF and peak reflow temperature of 260C, making it ideal for high-speed digital circuits.

Median Price

$1.390

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 31,868 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.150

10k+ parts

$1.030

31,868

-

$1.390

$1.150

$1.030

Verical

USA . 21,264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.438

10k+ parts

$1.288

21,264

-

-

$1.438

$1.288

DigiKey

USA . 19,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.950

10k+ parts

$0.950

19,640

-

-

$0.950

$0.950

Flip Electronics (Authorized)

USA . 19,640 parts In-Stock

1+ parts

-

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19,640

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Distributors (In-Stock)

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Digiode

USA . 971 parts In-Stock

1+ parts

$1.083

100+ parts

-

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971

$1.083

-

-

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$1.086

100+ parts

-

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900

$1.086

-

-

-

Vyrian

USA . 24,794 parts In-Stock

1+ parts

-

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-

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24,794

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-

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Flip Electronics

USA . 19,640 parts In-Stock

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19,640

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 24,748 parts In-Stock

1+ parts

$0.810

100+ parts

-

1k+ parts

-

10k+ parts

-

24,748

$0.810

-

-

-

Corohmni

South Africa . 438 parts In-Stock

1+ parts

$0.950

100+ parts

-

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438

$0.950

-

-

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Corphita

USA . 946 parts In-Stock

1+ parts

$1.026

100+ parts

-

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946

$1.026

-

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Argo Parts USA

USA . 333 parts In-Stock

1+ parts

$1.086

100+ parts

-

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333

$1.086

-

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QUARKTWIN TECHNOLOGY LTD

USA . 29,175 parts In-Stock

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29,175

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Continental Prestige Electronics

USA . 10,809 parts In-Stock

1+ parts

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100+ parts

$0.956

1k+ parts

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10,809

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$0.956

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TANS Electronics

Latvia . 7,042 parts In-Stock

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7,042

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Microchip USA

USA . 4,876 parts In-Stock

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4,876

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SupplyDigital Components

Austria . 2,868 parts In-Stock

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2,868

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Problanco Electronics

Mexico . 2,684 parts In-Stock

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2,684

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Kulean Microsystems

USA . 2,217 parts In-Stock

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2,217

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Perfect Parts

USA . 932 parts In-Stock

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932

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UHIMA Technologies

Türkiye . 598 parts In-Stock

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598

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$1.064

1k+ parts

$1.032

10k+ parts

$1.010

100

-

$1.064

$1.032

$1.010

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

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50

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Overview

Boost your electronics projects with the MC74ACT259DG by Onsemi! This high-quality latch and flip-flop component offers reliable performance and versatility for a wide range of applications. Onsemi's reputation for excellence ensures that you're getting a product that meets the highest standards. With its fast propagation delay and low trigger type, this component is perfect for industrial-grade projects. Upgrade your designs with the MC74ACT259DG and experience the value and benefits it delivers to you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the latch or flip-flop, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 12.5 ns

The low propagation delay ensures fast response times, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The compact rectangular shape saves space on the circuit board, making it ideal for designs with limited area.

Nominal Supply Voltage / Vsup (V): 5

The compatible supply voltage of 5V ensures seamless integration with standard electronic systems, offering versatility in usage.

Load Capacitance (CL): 50 pF

The low load capacitance minimizes interference and signal distortion, ensuring reliable operation in various environments.

Power Supplies (V): 5

With a power supply of 5V, this latch or flip-flop is energy-efficient and can be easily powered by common sources.

No. of Terminals: 16

The ample number of terminals allows for versatile connectivity options, accommodating different circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space efficiency and facilitates compact designs, ideal for miniaturized electronic devices.

Maximum I (ol): 24 Amp

The high maximum output current capability ensures robust performance, making this product suitable for demanding applications.

Technical Specifications

Latches & Flip-Flops MC74ACT259DG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

1:8 DMUX FOLLOWED BY LATCH

Family:

ACT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

12.5 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

3.9 mm

Trade Compliance

MC74ACT259DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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