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SMJ32020GBS

Texas Instruments

SMJ32020GBS by Texas Instruments

The Texas Instruments SMJ32020GBS is a 16-bit DSP with 544 RAM words, operating b/w -55°C to 100°C. Its MOS technology and 400 mA supply current make it ideal for digital signal processing applications requiring fixed-point format calculations in harsh environments.

Median Price

$427.637

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$342.110

100+ parts

$321.580

1k+ parts

$301.060

10k+ parts

-

1

$342.110

$321.580

$301.060

-

Verical

USA . 1 parts In-Stock

1+ parts

$427.637

100+ parts

$401.975

1k+ parts

$376.325

10k+ parts

-

1

$427.637

$401.975

$376.325

-

DigiKey

USA . 1 parts In-Stock

1+ parts

$427.640

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$427.640

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,936 parts In-Stock

1+ parts

$377.368

100+ parts

-

1k+ parts

-

10k+ parts

-

3,936

$377.368

-

-

-

Vyrian

USA . 9,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,406

-

-

-

-

ECAB

Sweden . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,094 parts In-Stock

1+ parts

$19.081

100+ parts

-

1k+ parts

$19.131

10k+ parts

-

1,094

$19.081

-

$19.131

-

DigiPath Technology Company

USA . 1,453 parts In-Stock

1+ parts

$21.010

100+ parts

$19.329

1k+ parts

-

10k+ parts

-

1,453

$21.010

$19.329

-

-

IDEA Electronic Components Group

UK . 1,564 parts In-Stock

1+ parts

$21.439

100+ parts

$20.367

1k+ parts

$19.295

10k+ parts

-

1,564

$21.439

$20.367

$19.295

-

ChromeModa Solutions

Germany . 890 parts In-Stock

1+ parts

$21.439

100+ parts

$17.580

1k+ parts

-

10k+ parts

-

890

$21.439

$17.580

-

-

Corohmni

South Africa . 2,665 parts In-Stock

1+ parts

$44.717

100+ parts

-

1k+ parts

-

10k+ parts

-

2,665

$44.717

-

-

-

Corphita

USA . 3,632 parts In-Stock

1+ parts

$357.507

100+ parts

-

1k+ parts

-

10k+ parts

-

3,632

$357.507

-

-

-

Microchip USA

USA . 2,374 parts In-Stock

1+ parts

$377.500

100+ parts

$367.430

1k+ parts

$373.380

10k+ parts

$368.190

2,374

$377.500

$367.430

$373.380

$368.190

Overview

Unlock the power of cutting-edge technology with the SMJ32020GBS from Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor (DSP) offers unparalleled quality and performance, making it perfect for a wide range of applications. From audio processing to telecommunications, this versatile product provides customers with value, benefits, and advantages that set it apart from the competition. Experience the difference with the SMJ32020GBS and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

The use of ceramic as the package body material provides excellent thermal conductivity and durability, making the product suitable for high operating temperatures and rugged environments.

Bit Size: 16

Having a 16-bit size allows for high precision in digital signal processing tasks, providing accurate results in data manipulation and signal processing.

No. of Terminals: 68

With 68 terminals, this DSP offers a good level of connectivity for interfacing with external devices and components, making it versatile in various applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C ensures reliable performance even in demanding thermal conditions, making it suitable for industrial and automotive applications.

RAM Words: 544

With 544 RAM words, the DSP can efficiently store and retrieve data during processing, enhancing its speed and efficiency in handling complex algorithms and calculations.

Technical Specifications

Digital Signal Processors (DSPs) SMJ32020GBS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

S-XPGA-P68

No. of Terminals:

68

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

RAM Words:

544

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

400 mA

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

SMJ32020GBS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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