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PADC12DL3200ACF

Texas Instruments

PADC12DL3200ACF by Texas Instruments

PADC12DL3200ACF by Texas Instruments is a 12-bit ADC with 2 analog in channels, operating at a sample rate of 3200 MHz. It features a max analog input voltage of ±1.04V and output formats include serial, parallel, and word. Ideal for industrial applications requiring high-speed and accurate analog-to-digital conversion.

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,899 parts In-Stock

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Digiode

USA . 392 parts In-Stock

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Nova Conductors

Japan . 43 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 620 parts In-Stock

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$6.638

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One Stop Electronics

USA . 374 parts In-Stock

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$16.000

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Ampacity Inc.

Singapore . 948 parts In-Stock

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$20.000

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Parana Technologies

USA . 427 parts In-Stock

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$23.719

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$24.344

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DigiPath Technology Company

USA . 2,051 parts In-Stock

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$26.118

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ChromeModa Solutions

Germany . 1,783 parts In-Stock

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$26.651

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$21.854

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IDEA Electronic Components Group

UK . 84 parts In-Stock

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$26.651

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$25.318

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$23.986

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Corphita

USA . 4,977 parts In-Stock

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Bastille Electronics

Australia . 22 parts In-Stock

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Overview

Discover the superior performance and reliability of the Texas Instruments PADC12DL3200ACF Analog-to-Digital Converter. With a reputation for excellence, Texas Instruments delivers cutting-edge technology in a compact SQUARE package. Ideal for industrial applications, this ADC boasts a 3200 MHz sample rate and 12-bit resolution. Experience the precision and efficiency of this innovative converter, providing unmatched quality and value to customers seeking top-tier performance. Elevate your projects with the industry-leading capabilities of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for long-term use.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatile input options in various applications.

Surface Mount: YES

The surface mount feature makes installation and mounting quick and easy.

Package Shape: SQUARE

The square shape saves space and allows for efficient placement on circuit boards.

No. of Bits: 12

With 12 bits, this ADC offers high resolution for accurate and precise data conversion.

No. of Terminals: 256

The large number of terminals allows for versatile connectivity options and integration into different systems.

Package Style (Meter): GRID ARRAY

The grid array package style ensures stable and reliable connections for optimal performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for use in extreme cold conditions.

Terminal Position: BOTTOM

The bottom terminal position makes for easy installation and connections.

Maximum Seated Height: 3.31 mm

The low seated height allows for compact designs and space-saving installations.

Width: 17 mm

The 17mm width provides a compact form factor for easy integration into electronic systems.

Length: 17 mm

The 17mm length ensures a square form factor for space-efficient installations.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and stability in harsh industrial environments.

Maximum Analog Input Voltage: 1.04 V

The high maximum analog input voltage allows for compatibility with a wide range of input signals.

Sample Rate: 3200 MHz

The high sample rate allows for fast and efficient data conversion in real-time applications.

Terminal Form: BALL

The ball terminal form ensures secure connections and reliable performance.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC method offers unique features and advantages over standard converters.

Nominal Supply Voltage: 1.1 V

The 1.1V supply voltage ensures efficient power consumption and compatibility with different power sources.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

The offset binary and 2's complement binary output bit codes offer flexibility in data representation.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for precise connections and compact designs.

Minimum Analog Input Voltage: -1.04 V

The low minimum analog input voltage allows for compatibility with a wide range of input signals.

Output Format: SERIAL, PARALLEL, WORD

The multiple output formats provide compatibility with different systems and devices.

Technical Specifications

Analog-to-Digital Converters PADC12DL3200ACF attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Sample Rate:

3200 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-1.04 V

Maximum Analog Input Voltage:

1.04 V

Nominal Supply Voltage:

1.1 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Bottom

No. of Terminals:

256

Terminal Form:

Terminal Pitch:

0.039 in (1 mm)

Surface Mount:

Yes

Width:

0.669 in (17 mm)

Length:

0.669 in (17 mm)

Maximum Seated Height:

0.13 in (3.31 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array

Package Shape:

Package Code:

BGA

Standards and Codes

JESD-30 Code:

S-PBGA-B256

Trade Compliance

PADC12DL3200ACF Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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