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PADC12DJ5200ALR

Texas Instruments

PADC12DJ5200ALR by Texas Instruments

The Texas Instruments PADC12DJ5200ALR is a 12-bit ADC with 2 analog in channels, 0.04882% max linearity error, and 10400 MHz sample rate. Ideal for applications requiring high-speed data conversion in compact spaces due to its small form factor and fine pitch grid array package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,823 parts In-Stock

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8,823

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Digiode

USA . 4,088 parts In-Stock

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4,088

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,175 parts In-Stock

1+ parts

$3.000

100+ parts

-

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1,175

$3.000

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Ampacity Inc.

Singapore . 738 parts In-Stock

1+ parts

$14.000

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-

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738

$14.000

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Parana Technologies

USA . 465 parts In-Stock

1+ parts

$14.410

100+ parts

-

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$14.851

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465

$14.410

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$14.851

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Semicontronic

India . 1,075 parts In-Stock

1+ parts

$16.000

100+ parts

$15.600

1k+ parts

$15.520

10k+ parts

-

1,075

$16.000

$15.600

$15.520

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ChromeModa Solutions

Germany . 6,890 parts In-Stock

1+ parts

$16.191

100+ parts

$13.277

1k+ parts

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6,890

$16.191

$13.277

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IDEA Electronic Components Group

UK . 414 parts In-Stock

1+ parts

$16.191

100+ parts

$15.381

1k+ parts

$14.572

10k+ parts

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414

$16.191

$15.381

$14.572

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AZTECH Wire

Italy . 499 parts In-Stock

1+ parts

$16.796

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499

$16.796

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Corphita

USA . 2,536 parts In-Stock

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2,536

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DigiPath Technology Company

USA . 1,965 parts In-Stock

1+ parts

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100+ parts

$14.598

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1,965

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$14.598

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Corohmni

South Africa . 101 parts In-Stock

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101

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Overview

Unlock the power of precision with the Texas Instruments PADC12DJ5200ALR Analog-to-Digital Converter. Crafted with expertise by Texas Instruments, this top-quality component offers unrivaled accuracy and reliability for a wide range of applications. Whether you're in the medical field, industrial sector, or beyond, this ADC delivers exceptional value and performance. Say goodbye to guesswork and hello to seamless data conversion with the PADC12DJ5200ALR. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the internal components of the converter.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatile and simultaneous data conversion from multiple sources.

Surface Mount: YES

Surface mount capability makes installation and integration into electronic circuits easier and more efficient.

No. of Bits: 12

12-bit resolution ensures accurate and precise conversion of analog signals to digital format.

Maximum Linearity Error (EL): 0.04882 %

Low linearity error percentage ensures minimal distortion or inaccuracies in the digital conversion process.

No. of Terminals: 144

Having 144 terminals allows for a wide range of connectivity options and flexibility in circuit design.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package style offer compact and efficient packaging for the converter.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures stability and performance in various environmental conditions.

Minimum Operating Temperature: -55 °C

Wide range of minimum operating temperature allows for use in extreme cold environments without compromising functionality.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and installation process in electronic systems.

Maximum Seated Height: 1.91 mm

Low seated height enables the converter to be used in compact and space-constrained applications.

Width: 10 mm

Compact width dimension makes the converter suitable for various PCB layouts and designs.

Length: 10 mm

Compact length dimension offers space efficiency in electronic systems and devices.

Total Dose (V): 300k Rad(Si)

High total dose rating ensures radiation tolerance for applications in harsh radiation environments.

Maximum Analog Input Voltage: 0.825 V

High maximum analog input voltage accommodates a wide range of input signal levels for conversion.

Sample Rate: 10400 MHz

High sample rate enables fast and real-time conversion of analog signals into digital data.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable performance in electronic circuits.

Converter Type: ADC, PROPRIETARY METHOD

Proprietary ADC method ensures unique and advanced conversion techniques for high-quality digital output.

Nominal Supply Voltage: 1.1 V

Low nominal supply voltage requirement for efficient power consumption and compatibility with various systems.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Offering multiple output bit code formats provides flexibility in data processing and interpretation.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density integration and compact circuit design.

Minimum Analog Input Voltage: -0.825 V

Accepting negative analog input voltage levels allows for versatile signal conversion capabilities.

Output Format: SERIAL

Serial output format facilitates data transmission and integration with digital communication interfaces.

Technical Specifications

Analog-to-Digital Converters PADC12DJ5200ALR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.04882 %

Sample Rate:

10400 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-825 mV

Maximum Analog Input Voltage:

825 mV

Nominal Supply Voltage:

1.1 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Total Ionizing Dose:

300k Rad(Si)

Form Factor

Terminal Position:

Bottom

No. of Terminals:

144

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.075 in (1.91 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA144,12X12,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

Trade Compliance

PADC12DJ5200ALR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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