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PADC09QJ1300AAV

Texas Instruments

PADC09QJ1300AAV by Texas Instruments

The Texas Instruments PADC09QJ1300AAV is a 9-bit ADC with 4 analog in channels, operating at a sample rate of 1300 MHz. Designed for automotive applications, it features a max analog input voltage of ±0.8V and operates in temperatures ranging from -40°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,150 parts In-Stock

1+ parts

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5,150

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Digiode

USA . 4,226 parts In-Stock

1+ parts

-

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-

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4,226

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 793 parts In-Stock

1+ parts

$10.153

100+ parts

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793

$10.153

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Parana Technologies

USA . 677 parts In-Stock

1+ parts

$23.954

100+ parts

-

1k+ parts

$24.606

10k+ parts

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677

$23.954

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$24.606

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One Stop Electronics

USA . 667 parts In-Stock

1+ parts

$25.000

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-

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667

$25.000

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DigiPath Technology Company

USA . 756 parts In-Stock

1+ parts

$26.377

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756

$26.377

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IDEA Electronic Components Group

UK . 1,040 parts In-Stock

1+ parts

$26.915

100+ parts

$25.569

1k+ parts

$24.224

10k+ parts

-

1,040

$26.915

$25.569

$24.224

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ChromeModa Solutions

Germany . 307 parts In-Stock

1+ parts

$26.915

100+ parts

$22.070

1k+ parts

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307

$26.915

$22.070

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Corphita

USA . 2,823 parts In-Stock

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2,823

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Overview

Experience unparalleled performance and precision with the PADC09QJ1300AAV Analog-to-Digital Converter by Texas Instruments. Designed with cutting-edge technology and superior craftsmanship, this product boasts a wide range of applications in automotive systems, industrial automation, and medical devices. With its high sample rate of 1300 MHz and proprietary conversion method, customers can trust in the reliability and accuracy of their data acquisition. Say goodbye to compromises and hello to top-tier quality with Texas Instruments' PADC09QJ1300AAV.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for automotive applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile connectivity and monitoring capabilities.

Surface Mount: YES

Being surface mountable makes installation and integration of the product easier and more efficient.

Screening Level: AEC-Q100

Conforming to the AEC-Q100 screening standard ensures high reliability and quality, essential for automotive use.

Package Shape: SQUARE

The square package shape offers efficient use of space and facilitates easier PCB layout.

No. of Bits: 9

With 9 bits resolution, this ADC provides accurate and precise conversion of analog signals.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh automotive environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures the product can perform reliably in various conditions.

Nominal Supply Voltage: 1.1 V

Operating at a low nominal supply voltage enhances efficiency and reduces power consumption.

Output Format: SERIAL

The serial output format allows for easy interfacing with other digital systems or microcontrollers.

Technical Specifications

Analog-to-Digital Converters PADC09QJ1300AAV attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

9

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

1300 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-800 mV

Maximum Analog Input Voltage:

800 mV

Nominal Supply Voltage:

1.1 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Bottom

No. of Terminals:

144

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.076 in (1.94 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Heat Sink/Slug, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA144,12X12,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

Screening Level:

AEC-Q100

Trade Compliance

PADC09QJ1300AAV Converters trade compliance attributes, and parameters.

ECCN

3A991.C.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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