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ADS1112IDGSTG4

Texas Instruments

ADS1112IDGSTG4 by Texas Instruments

Texas Instruments ADS1112IDGSTG4 is a 16-bit ADC with 3 analog in channels, 0.01% linearity error, and 5V power supply. Ideal for industrial applications requiring high precision data conversion at temperatures ranging from -40 to 85°C.

Median Price

$18.393

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$18.393

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Chip Stock

USA . 14,570 parts In-Stock

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Digiode

USA . 2,833 parts In-Stock

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2,833

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Vyrian

USA . 2,073 parts In-Stock

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VNN

France . 1,000 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 30 parts In-Stock

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Semicontronic

India . 481 parts In-Stock

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$4.000

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$3.900

1k+ parts

$3.880

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481

$4.000

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$3.880

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AZTECH Wire

Italy . 256 parts In-Stock

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$13.091

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Ampacity Inc.

Singapore . 1,105 parts In-Stock

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$15.000

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Corohmni

South Africa . 88 parts In-Stock

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$22.416

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$22.416

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Parana Technologies

USA . 757 parts In-Stock

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$23.525

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$24.159

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757

$23.525

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DigiPath Technology Company

USA . 2,341 parts In-Stock

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$25.904

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$23.832

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ChromeModa Solutions

Germany . 6,082 parts In-Stock

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$26.433

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$21.675

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$26.433

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IDEA Electronic Components Group

UK . 1,661 parts In-Stock

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$26.433

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$25.111

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$23.790

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$26.433

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$23.790

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Advanced Electronics

New Zealand . 92 parts In-Stock

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$26.848

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$25.506

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$25.506

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One Stop Electronics

USA . 753 parts In-Stock

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Lixinc

USA . 16,450 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,106 parts In-Stock

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Continental Prestige Electronics

USA . 4,646 parts In-Stock

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Argo Parts USA

USA . 4,237 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,404 parts In-Stock

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Microchip USA

USA . 2,383 parts In-Stock

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Corphita

USA . 1,750 parts In-Stock

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Robosynatics

Brazil . 1,000 parts In-Stock

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Lucentia Tech

USA . 1,000 parts In-Stock

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$0.501

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$0.501

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$0.501

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$0.501

$0.501

$0.501

Bastille Electronics

Australia . 300 parts In-Stock

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Modulus Dynamics

Lithuania . 45 parts In-Stock

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Overview

Enhance your electronics projects with the precision and reliability of the Texas Instruments ADS1112IDGSTG4 Analog-to-Digital Converter. Crafted with top-quality materials and cutting-edge technology, this converter boasts 16 bits of accuracy and a minuscule linearity error of just 0.01%. Whether you're designing industrial automation systems or creating high-performance measurement devices, this ADC delivers unmatched performance and efficiency. Trust Texas Instruments to provide the tools you need to bring your innovations to life. Elevate your designs with the ADS1112IDGSTG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications.

No. of Analog In Channels: 3

Having multiple analog input channels allows for versatile and complex signal processing capabilities.

Surface Mount: YES

Surface mount packaging makes installation and assembly easier, reducing production time and cost.

No. of Bits: 16

A higher number of bits leads to higher resolution and accuracy in converting analog signals to digital, making the product reliable for precise measurements.

Power Supplies (V): 5

Operating at a standard 5V power supply voltage simplifies integration into existing systems and eliminates the need for additional voltage conversions.

Maximum Operating Temperature: 85 °C

Being able to operate at high temperatures ensures reliability in harsh environments or applications with elevated temperatures.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures widens the range of applications where the product can be used.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The terminal finish provides good conductivity and corrosion resistance, enhancing the longevity of the product.

Maximum Analog Input Voltage: 5.5 V

Having a higher maximum analog input voltage range allows for versatile compatibility with different signal sources.

Sample Rate: 0.00024 MHz

A fast sample rate ensures accurate and real-time conversion of analog signals to digital data, making the product suitable for high-speed applications.

Technical Specifications

Analog-to-Digital Converters ADS1112IDGSTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

3

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Other Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.01 %

Sample Rate:

240 Hz

Maximum Conversion Time:

4.1 ns

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-200 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

350 μA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

10

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP10,.19,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G10

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS1112IDGSTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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