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PADS124S08IPBSR

Texas Instruments

PADS124S08IPBSR by Texas Instruments

The Texas Instruments PADS124S08IPBSR is a 24-bit ADC with 12 analog in channels. It features a flatpack, thin profile package style and operates in automotive temperature grades. With a sample rate of 0.004 MHz and serial output format, it's ideal for high-precision data acquisition applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,993 parts In-Stock

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3,993

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Digiode

USA . 3,451 parts In-Stock

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3,451

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Nova Conductors

Japan . 19 parts In-Stock

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19

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Ampacity Inc.

Singapore . 1,415 parts In-Stock

1+ parts

$8.000

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-

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1,415

$8.000

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AZTECH Wire

Italy . 378 parts In-Stock

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$11.170

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378

$11.170

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Corohmni

South Africa . 50 parts In-Stock

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$16.607

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50

$16.607

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$19.200

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$18.240

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$18.240

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870

$19.200

$18.240

$18.240

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Parana Technologies

USA . 1,981 parts In-Stock

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$24.342

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$25.013

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$24.342

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$25.013

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DigiPath Technology Company

USA . 816 parts In-Stock

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$26.803

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$24.659

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816

$26.803

$24.659

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IDEA Electronic Components Group

UK . 2,166 parts In-Stock

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$27.350

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$25.982

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$24.615

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2,166

$27.350

$25.982

$24.615

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ChromeModa Solutions

Germany . 844 parts In-Stock

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$27.350

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$22.427

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844

$27.350

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Semicontronic

India . 1,369 parts In-Stock

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$33.000

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$32.175

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$32.010

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1,369

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One Stop Electronics

USA . 1,536 parts In-Stock

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$36.000

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Corphita

USA . 4,004 parts In-Stock

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Continental Prestige Electronics

USA . 3,470 parts In-Stock

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Argo Parts USA

USA . 341 parts In-Stock

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341

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Modulus Dynamics

Lithuania . 300 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Robosynatics

Brazil . 10 parts In-Stock

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Lucentia Tech

USA . 10 parts In-Stock

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$27.430

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$27.430

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$27.430

10

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$27.430

$27.430

$27.430

Overview

Unlock a world of precision and reliability with the PADS124S08IPBSR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched quality and performance in Analog-to-Digital Converters. With 12 analog input channels and a 24-bit resolution, this product is perfect for a wide range of applications. Whether you're working in automotive or industrial settings, the PADS124S08IPBSR offers exceptional value, accuracy, and efficiency. Experience the benefits of superior engineering and cutting-edge technology with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and resistant to environmental factors, ensuring durability in various conditions.

No. of Analog In Channels: 12

Having 12 analog input channels allows for versatile input options and flexibility in capturing different types of analog signals.

Surface Mount: YES

The surface mount feature simplifies the installation process and makes the product suitable for compact circuit designs.

No. of Bits: 24

With 24 bits resolution, this product offers high precision in converting analog signals to digital data, ensuring accurate measurements.

No. of Terminals: 32

With 32 terminals, there are sufficient connection points for interfacing with other components, enabling versatile integration in circuits.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack and thin profile design with fine pitch spacing allows for efficient PCB layout and space-saving in system design.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions, making it suitable for industrial applications.

Temperature Grade: AUTOMOTIVE

Being Automotive grade ensures reliability and performance in automotive applications where temperature variations are common.

Sample Rate: 0.004 MHz

The high sample rate of 0.004 MHz allows for fast and accurate conversion of analog signals, making this product suitable for time-sensitive applications.

Converter Type: ADC, DELTA-SIGMA

The Delta-Sigma ADC converter type offers high-resolution and low noise performance, ideal for applications that require precise digital signal conversion.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V ensures compatibility with a wide range of power sources, making it easy to integrate into different systems.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and interpretation, making it easier to interface with digital systems.

Technical Specifications

Analog-to-Digital Converters PADS124S08IPBSR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

12

No. of Functions:

1

No. of Bits:

24

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

4 kHz

Electrical Specifications

Nominal Supply Voltage:

2.5 V

Nominal Negative Supply Voltage:

-2.5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-50 °C (-58 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Trade Compliance

PADS124S08IPBSR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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