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PADS4149IRGZT

Texas Instruments

PADS4149IRGZT by Texas Instruments

PADS4149IRGZT by Texas Instruments is a 14-bit ADC with 0.0305% linearity error, 250 MHz sample rate, and 1.8V supply voltage. It is used in industrial applications for high-speed data conversion with a max analog input voltage of ±2V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,561 parts In-Stock

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4,561

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Digiode

USA . 4,141 parts In-Stock

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4,141

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Nova Conductors

Japan . 29 parts In-Stock

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29

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Distributors (Availability)

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Parana Technologies

USA . 323 parts In-Stock

1+ parts

$5.412

100+ parts

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1k+ parts

$6.112

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323

$5.412

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$6.112

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DigiPath Technology Company

USA . 2,112 parts In-Stock

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$5.959

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2,112

$5.959

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ChromeModa Solutions

Germany . 2,474 parts In-Stock

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$6.081

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$4.986

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2,474

$6.081

$4.986

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IDEA Electronic Components Group

UK . 515 parts In-Stock

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$6.081

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$5.473

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515

$6.081

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$5.473

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AZTECH Wire

Italy . 377 parts In-Stock

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$10.486

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377

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Ampacity Inc.

Singapore . 133 parts In-Stock

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$13.000

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133

$13.000

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One Stop Electronics

USA . 1,605 parts In-Stock

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$21.000

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$21.000

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Continental Prestige Electronics

USA . 6,605 parts In-Stock

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Corphita

USA . 2,426 parts In-Stock

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Argo Parts USA

USA . 1,615 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Unlock the power of precision and reliability with the PADS4149IRGZT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers Analog-to-Digital Converters that set the standard for quality. With applications across various industries, this product offers unparalleled value and benefits to customers. Experience seamless performance and unmatched accuracy with the PADS4149IRGZT, designed to meet your needs with ease. Elevate your projects and achieve optimal results with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the converter, making it a reliable choice.

Surface Mount: YES

Being surface mountable allows for easy installation and efficient use of space on a PCB.

Package Shape: SQUARE

The square package shape is versatile and can easily fit into various design layouts.

No. of Bits: 14

With 14 bits, this converter offers high resolution and accuracy for precise analog-to-digital conversion.

Maximum Linearity Error (EL): 0.0305%

The low linearity error ensures accurate and consistent conversion results.

No. of Terminals: 48

The ample number of terminals allows for versatile connectivity options in a system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The multiple package styles provide flexibility for different mounting preferences and thermal management needs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this converter can perform reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range enables this converter to operate effectively in cold environments.

Terminal Position: QUAD

The quad terminal position facilitates easy integration and connection in a circuit.

Maximum Seated Height: 1 mm

The low seated height makes this converter suitable for applications with space constraints.

Width: 7 mm

The compact width allows for efficient placement on a PCB.

Length: 7 mm

The small length of the converter enables a compact overall design for a system.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in harsh operating conditions.

Maximum Analog Input Voltage: 2 V

The high maximum analog input voltage range allows for versatile signal processing capabilities.

Sample Rate: 250 MHz

The high sample rate enables fast and accurate conversion of analog signals.

Terminal Form: NO LEAD

The no lead terminal form simplifies assembly and improves reliability.

Maximum Supply Current: 113 mA

The low maximum supply current helps conserve power and extend battery life in portable devices.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary conversion method used in this ADC ensures unique performance advantages.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage contributes to power efficiency and compatibility with low-power systems.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

The multiple output bit code options provide flexibility for various digital signal processing techniques.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for compact layout and efficient use of board space.

Minimum Analog Input Voltage: -2 V

The wide input voltage range accommodates a variety of signal levels for versatile applications.

Output Format: SERIAL, PARALLEL, WORD

The multiple output formats offer compatibility with different interface standards and system architectures.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold capability allows for accurate sampling of analog signals for precise digital conversion.

Technical Specifications

Analog-to-Digital Converters PADS4149IRGZT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Maximum Linearity Error (EL):

0.0305 %

Sample Rate:

250 MHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

113 mA

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Trade Compliance

PADS4149IRGZT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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