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PADS5281IRGCT

Texas Instruments

PADS5281IRGCT by Texas Instruments

PADS5281IRGCT by Texas Instruments is a 12-bit ADC with 8 analog in channels, operating at a sample rate of 50 MHz. It has a max linearity error of 0.0366% and supports power supplies of 1.8V and 3.3V. Ideal for industrial applications requiring high-speed data conversion with precise accuracy in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,517 parts In-Stock

1+ parts

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4,517

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Digiode

USA . 2,519 parts In-Stock

1+ parts

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2,519

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,505 parts In-Stock

1+ parts

$8.564

100+ parts

-

1k+ parts

$9.224

10k+ parts

-

1,505

$8.564

-

$9.224

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DigiPath Technology Company

USA . 402 parts In-Stock

1+ parts

$9.430

100+ parts

$8.675

1k+ parts

-

10k+ parts

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402

$9.430

$8.675

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ChromeModa Solutions

Germany . 4,799 parts In-Stock

1+ parts

$9.622

100+ parts

$7.890

1k+ parts

-

10k+ parts

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4,799

$9.622

$7.890

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IDEA Electronic Components Group

UK . 1,165 parts In-Stock

1+ parts

$9.622

100+ parts

$9.141

1k+ parts

$8.660

10k+ parts

-

1,165

$9.622

$9.141

$8.660

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AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$15.752

100+ parts

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215

$15.752

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One Stop Electronics

USA . 547 parts In-Stock

1+ parts

$23.000

100+ parts

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547

$23.000

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Corphita

USA . 416 parts In-Stock

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416

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Overview

Discover the unparalleled quality and precision of the PADS5281IRGCT by Texas Instruments, a leading manufacturer in the industry. This Analog-to-Digital Converter offers 12 bits of accuracy across 8 channels, making it ideal for a wide range of industrial applications. With a maximum linearity error of just 0.0366%, this converter delivers reliable performance at an affordable price point. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and unlocks new possibilities for your projects. Elevate your designs with the PADS5281IRGCT and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

No. of Analog In Channels: 8

Allows for multiple input signals to be converted simultaneously, increasing efficiency.

Surface Mount: YES

Enables easy and efficient integration onto circuit boards, saving space and simplifying assembly.

No. of Bits: 12

Provides high resolution for accurate analog-to-digital conversion.

Maximum Linearity Error (EL): 0.0366 %

Ensures precision in converting analog signals to digital values, reducing errors.

Power Supplies (V): 1.8,3.3

Supports a wide range of power supply voltages, increasing compatibility with different systems.

No. of Terminals: 64

Allows for versatile connection options and easy integration into complex circuit layouts.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers flexibility in mounting and thermal management, making it suitable for various applications.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Provides a wide operating temperature range, making it suitable for harsh environments.

Terminal Position: QUAD

Facilitates easy connection and placement on circuit boards, improving overall reliability.

Maximum Seated Height: 1 mm

Compact size allows for space-saving design and efficient use of PCB space.

Width: 9 mm

Compact form factor enables easy integration into various electronic devices.

Length: 9 mm

Compact form factor enables easy integration into various electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where reliability and performance are crucial.

Maximum Analog Input Voltage: 2 V

Supports a wide range of input voltages, making it versatile for different signal levels.

Sample Rate: 50 MHz

High sample rate enables fast and accurate conversion of analog signals.

Technology: CMOS

Uses CMOS technology for low power consumption and high performance.

Terminal Form: NO LEAD

Lead-free terminals for compliance with environmental regulations and improved reliability.

Converter Type: ADC, PROPRIETARY METHOD

Utilizes a proprietary method for analog-to-digital conversion, ensuring high accuracy and performance.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with a wide range of systems and applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Provides flexibility in output coding formats, accommodating different system requirements.

Terminal Pitch: 0.5 mm

Fine pitch allows for high-density mounting, saving space on the PCB.

Minimum Analog Input Voltage: 0 V

Supports input signals down to 0 volts, enabling accurate conversion of low-level signals.

Output Format: SERIAL

Serial output format for easy integration with microcontrollers and digital signal processing systems.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold feature ensures accurate sampling of analog signals, improving overall conversion accuracy.

Technical Specifications

Analog-to-Digital Converters PADS5281IRGCT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0366 %

Sample Rate:

50 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8,3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

Trade Compliance

PADS5281IRGCT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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