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PADS7138QRTERQ1

Texas Instruments

PADS7138QRTERQ1 by Texas Instruments

PADS7138QRTERQ1 by Texas Instruments is a 12-bit ADC with 8 analog in channels, 0.036621% EL, and 0.14 MHz sample rate. Designed for automotive applications, it operates b/w -40 to 125 °C with a supply voltage of 1.65-3.3 V. The chip carrier package has a very thin profile and quad terminal position for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,499 parts In-Stock

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3,499

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Digiode

USA . 818 parts In-Stock

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818

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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One Stop Electronics

USA . 1,447 parts In-Stock

1+ parts

$5.000

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1,447

$5.000

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AZTECH Wire

Italy . 882 parts In-Stock

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$9.907

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882

$9.907

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Parana Technologies

USA . 374 parts In-Stock

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$22.626

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$2,101.128

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$20.363

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374

$22.626

$2,101.128

$20.363

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DigiPath Technology Company

USA . 1,753 parts In-Stock

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$24.914

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$24.914

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ChromeModa Solutions

Germany . 4,604 parts In-Stock

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$25.422

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$20.846

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4,604

$25.422

$20.846

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IDEA Electronic Components Group

UK . 1,546 parts In-Stock

1+ parts

$25.422

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$24.151

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$22.880

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1,546

$25.422

$24.151

$22.880

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Ampacity Inc.

Singapore . 283 parts In-Stock

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$28.000

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Corphita

USA . 4,364 parts In-Stock

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Continental Prestige Electronics

USA . 1,586 parts In-Stock

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Argo Parts USA

USA . 1,330 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Discover the power of precision with the PADS7138QRTERQ1 by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments delivers unmatched quality and reliability. Ideal for automotive applications with its AEC-Q100 screening level, this 12-bit ADC offers 8 analog input channels, ensuring accurate conversion with minimal linearity error. With a compact square package and low supply voltage requirements, this chip carrier is perfect for space-constrained designs. Trust Texas Instruments to provide innovative solutions that meet your needs. Experience the difference with the PADS7138QRTERQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for a wide range of applications.

No. of Analog In Channels: 8

Allows for multiple signals to be processed simultaneously, increasing efficiency.

Surface Mount: YES

Easy to install and saves space on a circuit board.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality assurance.

No. of Bits: 12

Higher resolution for more accurate conversion of analog signals.

Maximum Linearity Error (EL): 0.036621%

Provides precise output even at very low error rates.

No. of Terminals: 16

Sufficient terminals for connecting to other components in a circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers versatility in mounting options depending on the application requirements.

Minimum Supply Voltage: 1.65 V

Works efficiently with low supply voltage, saving energy.

Maximum Operating Temperature: 125 °C

Suitable for operating in high-temperature environments without degradation.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Position: QUAD

Quad arrangement for easy connections and layout on a PCB.

Maximum Conversion Time: 1.4 us

Fast conversion time for real-time data processing.

Maximum Seated Height: 0.8 mm

Low profile design for space-constrained applications.

Width: 3 mm

Compact size for integration into various electronic devices.

Length: 3 mm

Small footprint to fit in tight spaces.

Temperature Grade: AUTOMOTIVE

Designed to meet the demanding requirements of automotive applications.

Maximum Analog Input Voltage: 5.5 V

Capable of handling high input voltages without damage.

Sample Rate: 0.14 MHz

High sample rate for capturing fast-changing analog signals.

Terminal Form: NO LEAD

Lead-free design for environmentally friendly considerations.

Maximum Supply Current: 0.21 mA

Low power consumption for energy-efficient operation.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Uses a precise and efficient conversion method for accurate results.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with most electronic systems.

Output Bit Code: BINARY

Binary output for easy digital signal processing.

Terminal Pitch: 0.5 mm

Fine pitch for high-density mounting on a PCB.

Minimum Analog Input Voltage: 0 V

Able to detect zero input voltage, useful for various applications.

Output Format: SERIAL

Serial output format for easy interfacing with other digital components.

Technical Specifications

Analog-to-Digital Converters PADS7138QRTERQ1 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.036621 %

Sample Rate:

140 kHz

Maximum Conversion Time:

1.4 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Current:

210 μA

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC16,.12SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N20

Screening Level:

AEC-Q100

Trade Compliance

PADS7138QRTERQ1 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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