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PADS117L11IRUKR

Texas Instruments

PADS117L11IRUKR by Texas Instruments

PADS117L11IRUKR by Texas Instruments is a 16-bit ADC with 0.0005% linearity error, operating at 1 MHz sample rate. It features a 20-terminal chip carrier package suitable for applications requiring high precision analog-to-digital conversion in compact spaces. With a wide temperature range of -40 to 125 °C, it is ideal for industrial and automotive electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,812 parts In-Stock

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Digiode

USA . 4,531 parts In-Stock

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4,531

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,280 parts In-Stock

1+ parts

$4.000

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1,280

$4.000

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Parana Technologies

USA . 24 parts In-Stock

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$9.400

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$10.018

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24

$9.400

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$10.018

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ChromeModa Solutions

Germany . 4,871 parts In-Stock

1+ parts

$10.562

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$8.661

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4,871

$10.562

$8.661

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IDEA Electronic Components Group

UK . 2,095 parts In-Stock

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$10.562

100+ parts

$10.034

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$9.506

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2,095

$10.562

$10.034

$9.506

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AZTECH Wire

Italy . 469 parts In-Stock

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$13.031

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469

$13.031

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One Stop Electronics

USA . 631 parts In-Stock

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$27.000

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631

$27.000

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Continental Prestige Electronics

USA . 6,594 parts In-Stock

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Corphita

USA . 3,713 parts In-Stock

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Argo Parts USA

USA . 1,093 parts In-Stock

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1,093

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DigiPath Technology Company

USA . 747 parts In-Stock

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$9.523

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747

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$9.523

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the PADS117L11IRUKR by Texas Instruments. Crafted with precision and expertise, this ADC offers unparalleled quality and reliability for a wide range of applications. With 16 bits of resolution and a maximum linearity error of just 0.0005%, this converter delivers exceptional accuracy and performance. Whether you're designing industrial equipment, medical devices, or consumer electronics, this compact chip carrier package is the perfect solution. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations. Choose the PADS117L11IRUKR for seamless integration and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as package body material makes the product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy integration into electronic circuit boards, making installation and assembly convenient.

No. of Bits: 16

With 16 bits, this ADC offers high resolution and accuracy in converting analog signals to digital, making it ideal for precise measurements.

Maximum Linearity Error (EL): 0.0005 %

The low linearity error ensures that the output digital values closely match the input analog signals, leading to accurate data conversion.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options, enabling the ADC to interface with various input and output devices.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage requirement makes this ADC energy-efficient and suitable for battery-operated applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this ADC can withstand harsh environmental conditions and maintain accurate performance.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 125°C ensures reliable operation in extreme cold or hot environments.

Terminal Position: QUAD

The quad terminal position facilitates easy connection and integration into electronic circuits, enhancing the overall usability of the product.

Width: 3 mm

The compact width of 3mm allows for space-saving installation in compact electronics or tight PCB layouts.

Length: 3 mm

The small length of 3mm further contributes to the product's compact design, making it suitable for applications with limited space.

Maximum Analog Input Voltage: 5 V

The 5V maximum analog input voltage range ensures compatibility with a wide range of sensors and signal sources, making the ADC versatile.

Sample Rate: 1 MHz

With a high sample rate of 1 MHz, this ADC can accurately capture and convert fast-changing analog signals, making it suitable for real-time applications.

Output Bit Code: BINARY

The output in binary format simplifies data processing and analysis, ensuring compatibility with standard digital systems and interfaces.

Output Format: SERIAL

The serial output format enables easy transmission of digital data to other devices, simplifying communication and data transfer processes.

Technical Specifications

Analog-to-Digital Converters PADS117L11IRUKR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0005 %

Sample Rate:

1 MHz

Electrical Specifications

Maximum Analog Input Voltage:

5 V

Minimum Supply Voltage:

1.65 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC20,.12SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N20

Trade Compliance

PADS117L11IRUKR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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