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PADC12DJ5200ALREP

Texas Instruments

PADC12DJ5200ALREP by Texas Instruments

PADC12DJ5200ALREP by Texas Instruments is a 12-bit ADC with 0.048828% EL, 144 terminals, and 10400 MHz sample rate. It is used in applications requiring high-speed data conversion like telecommunications equipment due to its fine-pitch grid array package style and serial output format.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,230 parts In-Stock

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4,230

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Digiode

USA . 3,172 parts In-Stock

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3,172

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,624 parts In-Stock

1+ parts

$4.000

100+ parts

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1,624

$4.000

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AZTECH Wire

Italy . 513 parts In-Stock

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$8.706

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513

$8.706

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Semicontronic

India . 495 parts In-Stock

1+ parts

$11.000

100+ parts

$10.725

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$10.670

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495

$11.000

$10.725

$10.670

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Parana Technologies

USA . 56 parts In-Stock

1+ parts

$11.725

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$12.121

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56

$11.725

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$12.121

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DigiPath Technology Company

USA . 1,592 parts In-Stock

1+ parts

$12.911

100+ parts

$11.878

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1,592

$12.911

$11.878

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ChromeModa Solutions

Germany . 6,854 parts In-Stock

1+ parts

$13.174

100+ parts

$10.803

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6,854

$13.174

$10.803

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IDEA Electronic Components Group

UK . 768 parts In-Stock

1+ parts

$13.174

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$12.515

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$11.857

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768

$13.174

$12.515

$11.857

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One Stop Electronics

USA . 971 parts In-Stock

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$28.000

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971

$28.000

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Corphita

USA . 2,700 parts In-Stock

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2,700

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Corohmni

South Africa . 239 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the PADC12DJ5200ALREP by Texas Instruments. Crafted with precision and quality in mind, this converter offers unparalleled accuracy and reliability for a wide range of applications. From industrial automation to consumer electronics, this product delivers value and performance that exceeds expectations. Trust in Texas Instruments' expertise and innovation to take your projects to the next level. Choose the PADC12DJ5200ALREP and unlock endless possibilities in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for long-lasting performance.

Surface Mount: YES

Easy to install and saves space on PCB.

No. of Bits: 12

High resolution for accurate analog to digital conversion.

Maximum Linearity Error (EL): 0.048828 %

High accuracy in conversion process.

No. of Terminals: 144

Provides flexibility in connectivity options.

Maximum Operating Temperature: 125 °C

Can operate in a wide range of temperatures.

Minimum Operating Temperature: -55 °C

Suitable for use in extreme cold environments.

Maximum Analog Input Voltage: 0.825 V

Accepts a wide range of analog input voltages.

Sample Rate: 10400 MHz

High sampling rate for fast and accurate data conversion.

Maximum Supply Current: 1.65 mA

Efficient power consumption.

Converter Type: ADC, PROPRIETARY METHOD

Uses a proprietary method for enhanced performance.

Nominal Supply Voltage: 1.1 V

Low supply voltage requirement for energy efficiency.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Compatible with different output formats.

Minimum Analog Input Voltage: -0.825 V

Supports negative analog input voltages.

Output Format: SERIAL

Easy to interface with other digital systems.

Technical Specifications

Analog-to-Digital Converters PADC12DJ5200ALREP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.048828 %

Sample Rate:

10400 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-825 mV

Maximum Analog Input Voltage:

825 mV

Nominal Supply Voltage:

1.1 V

Maximum Supply Current:

1.65 mA

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Form Factor

Terminal Position:

Bottom

No. of Terminals:

144

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.075 in (1.91 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA144,12X12,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

Trade Compliance

PADC12DJ5200ALREP Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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