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PADC12QJ1600ALR

Texas Instruments

PADC12QJ1600ALR by Texas Instruments

ADC, PROPRIETARY METHOD; Terminal Form: BALL; No. of Terminals: 144; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B144;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,912 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,912

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Digiode

USA . 186 parts In-Stock

1+ parts

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100+ parts

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186

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,404 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,404

$5.000

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Parana Technologies

USA . 1,414 parts In-Stock

1+ parts

$7.607

100+ parts

-

1k+ parts

$8.121

10k+ parts

-

1,414

$7.607

-

$8.121

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ChromeModa Solutions

Germany . 826 parts In-Stock

1+ parts

$8.547

100+ parts

$7.009

1k+ parts

-

10k+ parts

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826

$8.547

$7.009

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IDEA Electronic Components Group

UK . 528 parts In-Stock

1+ parts

$8.547

100+ parts

$8.120

1k+ parts

$7.692

10k+ parts

-

528

$8.547

$8.120

$7.692

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Semicontronic

India . 1,616 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

10k+ parts

-

1,616

$9.000

$8.775

$8.730

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AZTECH Wire

Italy . 428 parts In-Stock

1+ parts

$10.866

100+ parts

-

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428

$10.866

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One Stop Electronics

USA . 1,026 parts In-Stock

1+ parts

$13.000

100+ parts

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1,026

$13.000

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Corphita

USA . 4,097 parts In-Stock

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4,097

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DigiPath Technology Company

USA . 583 parts In-Stock

1+ parts

-

100+ parts

$7.706

1k+ parts

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583

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$7.706

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Corohmni

South Africa . 466 parts In-Stock

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466

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Technical Specifications

Analog-to-Digital Converters PADC12QJ1600ALR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.04638 %

Sample Rate:

1600 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-1.04 V

Maximum Analog Input Voltage:

1.04 V

Nominal Supply Voltage:

1.1 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Total Ionizing Dose:

300k Rad(Si)

Form Factor

Terminal Position:

Bottom

No. of Terminals:

144

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.075 in (1.91 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array

Package Shape:

Package Equivalence Code:

BGA144,12X12,32

Package Code:

BGA

Standards and Codes

JESD-30 Code:

S-PBGA-B144

Trade Compliance

PADC12QJ1600ALR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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