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PADC12DJ32ZMX/EM20

Texas Instruments

PADC12DJ32ZMX/EM20 by Texas Instruments

The Texas Instruments PADC12DJ32ZMX/EM20 is a 12-bit ADC with 2 analog in channels, operating from -55°C to 125°C. It features a sample rate of 6400 MHz and uses a proprietary method for conversion. This military-grade converter in grid array style is ideal for high-speed applications requiring precise binary output.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,121 parts In-Stock

1+ parts

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8,121

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Digiode

USA . 89 parts In-Stock

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89

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 812 parts In-Stock

1+ parts

$7.364

100+ parts

-

1k+ parts

$7.858

10k+ parts

-

812

$7.364

-

$7.858

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DigiPath Technology Company

USA . 513 parts In-Stock

1+ parts

$8.109

100+ parts

$7.460

1k+ parts

-

10k+ parts

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513

$8.109

$7.460

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ChromeModa Solutions

Germany . 5,027 parts In-Stock

1+ parts

$8.274

100+ parts

$6.785

1k+ parts

-

10k+ parts

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5,027

$8.274

$6.785

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IDEA Electronic Components Group

UK . 1,228 parts In-Stock

1+ parts

$8.274

100+ parts

$7.860

1k+ parts

$7.447

10k+ parts

-

1,228

$8.274

$7.860

$7.447

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AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$11.042

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644

$11.042

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One Stop Electronics

USA . 1,484 parts In-Stock

1+ parts

$17.000

100+ parts

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1,484

$17.000

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Corphita

USA . 1,326 parts In-Stock

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1,326

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Overview

Elevate your analog-to-digital conversion experience with the PADC12DJ32ZMX/EM20 by Texas Instruments. Crafted with precision and expertise, this top-tier ADC boasts unparalleled quality and reliability. Ideal for military-grade applications, this product offers a seamless conversion process with a high sample rate of 6400 MHz. Say goodbye to compromise and hello to superior performance with the PADC12DJ32ZMX/EM20 - where value meets excellence. Elevate your projects today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability in harsh environments, making this product suitable for industrial applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatile input options and flexibility in handling multiple signals concurrently.

Surface Mount: YES

Being surface mountable simplifies the installation process and saves space on the PCB, making integration into electronic systems more efficient.

No. of Bits: 12

With a 12-bit resolution, this ADC offers high accuracy and precision in converting analog signals to digital data, making it suitable for applications requiring detailed measurements.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in challenging thermal environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows for use in a wide range of temperature conditions, making this ADC versatile for various applications.

Sample Rate: 6400 MHz

With a high sample rate of 6400 MHz, this ADC can process signals quickly and efficiently, making it suitable for high-speed data acquisition applications.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this ADC offers high reliability and robustness, making it suitable for mission-critical applications where durability is essential.

Technical Specifications

Analog-to-Digital Converters PADC12DJ32ZMX/EM20 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Binary

Sample Rate:

6400 MHz

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Bottom

No. of Terminals:

196

Terminal Form:

Surface Mount:

Yes

Width:

0.591 in (15 mm)

Length:

0.591 in (15 mm)

Packaging

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style:

Grid Array

Package Shape:

Package Code:

LGA

Standards and Codes

JESD-30 Code:

S-CBGA-N196

Trade Compliance

PADC12DJ32ZMX/EM20 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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